Qualcomm Incorporated

Sumarlin William

Ronald Alton

Vinayak Nana Mehetre

Louis Louie

Thermal management aspects include a serial databus; a central processing unit (CPU); a graphics processing unit (GPU); a neural signal processor (NSP); an always on subsystem (AOSS); the serial databus, the CPU, the GPU, the NSP and the AOSS are implemented on a system on a chip; wherein the CPU includes a first plurality of thermal sensors and a first plurality of controllers, each of the first plurality of thermal sensors is coupled to each of the first plurality of controllers; wherein the NSP includes a second plurality of thermal sensors and a second plurality of controllers, each of the second plurality of thermal sensors is coupled to each of the second plurality of controllers; and wherein the AOSS includes a third plurality of thermal sensors and a third plurality of controllers, each of the third plurality of thermal sensors is coupled to each of the third plurality of controllers.

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San Diego, CA, United States of America

Sumarlin William