Advanced Micro Devices Corporation

Ati Technologies Ulc

Sukesh Shenoy

Indrani Paul

Christopher M Jaggers

Michael J Austin

Adam N C Clark

Mustansir M Pratapgarhwala

Robert Edward Radke

Chris Janak

Christopher M Helberg

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.

Component cooler for a computing device

An integrated coprocessor such as an accelerated processing unit (APU) generates commands for execution on a discrete coprocessor such as a discrete graphics processing unit (dGPU). Power distribution circuitry selectively provides power to the APU and the dGPU based on characteristics of workloads executing on the APU and the dGPU and based on a platform power limit that is shared by the APU and the dGPU. In some cases, the power distribution circuitry determines a first power provided to the APU and a second power provided to the dGPU. The power distribution circuitry increases the second power provided to the dGPU in response to a sum of the first and second powers being less than the platform power limit. In some cases, the power distribution circuitry modifies the power provided to the APU, the dGPU, or both in response to changes in temperatures measured by a set of sensors.

Distributing power shared between an accelerated processing unit and a discrete graphics processing unit

Various methods an apparatus to use facial recognition in a computing device are disclosed. In one aspect, a method of controlling a component of a computing device is provided. The method includes taking an IR image of a user and a background with an IR sensor of a computing device. The computing device is in a location. The IR image is segmented into user image data and background image data. An ambient temperature of the location is determined using the background image data. An aspect of the component is controlled based on the ambient temperature.

Ambient temperature reporting through infrared facial recognition

Various thermal management devices for providing thermal management of integrated circuit chips are disclosed. In one aspect, a thermal management device is provided that has a heat spreader plate that includes mechanical connection structures to enable the heat spreader plate to mount on a first circuit board and thermally contact the integrated circuit chip when the integrated circuit chip is directly mounted on the first circuit board and to enable the heat spreader plate to mount on a second circuit board having a socket and thermally contact the integrated circuit chip when the integrated circuit chip is mounted in the socket.

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Austin, TX, United States of America

Sukesh Shenoy