Hyundai Mobis Co., Ltd.

Samsung Electronics Co., Ltd.

Suk Won Lee

Kwang Yoon Kim

Sin Kwon

Dae Jung Kim

Young Tae Cho

Jung Woo Seo

Jeong Gil Kim

Ji Ho Uh

Seung Min Ryu

Kyeong Min Yeo

A steering device for a vehicle, the steering device including: a rack housing unit; a rack drive unit inserted into the rack housing unit and configured to be movable in an axial direction; a casing unit coupled to the rack housing unit; a rotary unit mounted in the casing unit and configured to engage with the rack drive unit and be rotatable; and a detection unit mounted on the casing unit and configured to measure a rotation of the rotary unit, thereby implementing a degree of shape freedom and simplifying an assembly structure.

Steering device for vehicle

A steering apparatus for a vehicle includes: a rack housing; a rack bar inserted into an inner portion of the rack housing and moving linearly in a lengthwise direction of the rack housing; a housing mounted on the rack housing; a first sensing section mounted on the housing to sense an amount of movement of the rack bar while being rotated in mesh with the rack bar as the rack bar moves linearly on the rack housing; and a second sensing section mounted on the rack housing to sense the amount of movement of the rack bar within an on-center section.

Steering apparatus for vehicle

A steering system for a vehicle includes a housing section, a rack section configured to penetrate the housing section, a case section mounted in the housing section, and a sensor section, mounted in the case section, configured to engage the rack section and sense an amount of movement of the rack section while being rotated.

Steering system for vehicle

Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Flip chip packaging method, and flux head manufacturing method applied to the same

In forming a pattern on a substrate with reduced pattern error using a mold having an area smaller than an area of the substrate, a first resin pattern is formed on at least a first of a plurality of regions of an etching object layer by imprinting resin applied to the etching object layer using a first mold The etching object layer is then etched using the first resin pattern as an etching mask. A second resin pattern is formed on at least a second of the plurality of regions by imprinting resin applied to the etching object layer using a second mold. The etching object layer is again etched using the second resin pattern as an etching mask.

Growing community of inventors

Yongin-si, South Korea

Suk Won Lee