Lg Chem, Ltd

Suk Ky Chang

Hyun Jee Yoo

Yoon Gyung Cho

Jung Sup Shim

Seung Min Lee

Se Woo Yang

Min Soo Park

Kyung Yul Bae

Hyun Suk Kim

Se Ra Kim

Hyo Sook Joo

Jung Ok Moon

Yoon Tae Hwang

Sung Jong Kim

Woo Ha Kim

No Ma Kim

Cha Hun Ku

Suk Chin Lee

Kwang Jin Jeong

Byung Kyu Jung

In Cheon Han

Jong Rok Jeon

Jang Soon Kim

Jeong Min Ha

Ki Seok Jang

Hyun Ju Cho

Yong Su Park

Ji Young Hwang

Joon Hyung Kim

Eun Suk Park

Se-Ra Kim

Ban Seok Choi

Jae Gwan Lee

Seung Joon Park

Kyun Il Rah

Wook Hwan Kim

Min Ki Lee

Sung Hyun Nam

Jung Hyoung Lee

Sang Ki Chun

Jong Hyun Jung

Jun Rye Choi

Bong Keun Lee

Dong Han Kho

An Na Lee

Ji Yeon Seong

Byeong Gyu Cho

Jung-Sup Shim

Seung Min Yoo

Yoon Jung Baek

Yong Sung Goo

Byoung Soo Lee

Jine Young Lee

Geun Hee Lee

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

Pressure-sensitive adhesive composition

Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.

Encapsulation film and method for encapsulating organic electronic device using same

An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Adhesive and method of encapsulating organic electronic device using the same

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

Adhesive film

Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.

Adhesive film and sealing product for organic electronic device using same

Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns

The present invention relates to a curable composition and an adhesive film including the same, and provides a curable composition and an adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifespan and durability of an organic electronic device.

Curable composition

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same

The present invention is relates to conductive laminate. The conductive laminate is applied to a touch panel or touch screen, thereby exhibiting excellent durability, and a pressure-sensitive adhesive layer included in the conductive laminate may prevent a change in resistance of a conductive layer, and effectively inhibit lift-off or peeling, or generation of bubbles at a pressure-sensitive adhesive interface. As a result, performances of the touch panel or touch screen including the conductive laminate may be stably maintained for a long time.

Conductive laminate, and touch panel comprising same

Provided are a base film, a laminate, and a method of forming a polarizing film. Particularly, a base film which may effectively form a polarizing film having a thickness of approximately 10, 8, 7, 6, or 5 &#x3bc;m or less and exhibiting excellent functions such as polarizing performance, a laminate, and a method of forming the same are provided. Therefore, a polarizing film may be formed by preventing tearing or curling during an elongation process, and easily elongating a polarizing material such as a polyvinylalcohol-based resin.

Laminate

The present invention relates to swelling tape for filling a gap and its use. The swelling tape is, for example, applied between gaps in which a fluid is present, thereby being deformed into a three-dimensional shape to fill the gap and fix an object separated by gaps as needed.

Swelling tape for filling gap

Growing community of inventors

Daejeon, South Korea

Suk Ky Chang