Samsung Electro-Mechanics Co., Ltd.

Suk Kee Hong

Yeong Gyu Lee

Jung Hyun Lee

Sang Kee Yoon

Yoon Shik Hong

Sung Cheon Jung

Ohk Kun Lim

Young Gyu Lee

Dong Hyun Park

Heung Woo Park

Joon Seok Kang

Hyun Kee Lee

Chang Su Park

A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an MEMS element provided on the base substrate, joining a lid glass to the metal layer, and providing a side double-sealing member on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment. The MEMS package includes a base substrate, with an MEMS element provided on a surface of the base substrate; a lid glass joined to the base substrate such that the lid glass covers the MEMS element and transmits incident light; a dam sealing member provided on a surface of the base substrate and a side surface of the lid glass, thus hermetically sealing the MEMS element from the external environment; and a second sealing member deposited on an upper surface of the dam sealing member such that the second sealing member is provided on the surface of the base substrate and the side surface of the lid glass, thus secondarily hermetically sealing the MEMS element from the external environment.

Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same

Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

Optical modulator module package using flip-chip mounting technology

A micro-electro-mechanical system (MEMS) package having a hydrophobic layer is disclosed. The MEMS package includes: a base substrate, with an MEMS element provided on a surface of the base substrate; a lid, spaced apart from the MEMS element provided on the base substrate and covering the MEMS element; a side sealing member provided on a side surface of the base substrate and the surface of the lid, thus hermetically sealing the MEMS element from an external environment; and a hydrophobic layer which covers the part of the side sealing member that is exposed to the external environment, thus removing the hydrophilia from the side sealing member.

Micro-electro-mechanical system (MEMS) package having hydrophobic layer

A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side sealing member on a side surface of the substrate; and covering the lid and the substrate with a metal sealing member, thus hermetically sealing the MEMS element from the external environment.

Micro-electro-mechanical system (MEMS) package having metal sealing member

Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.

Optical modulator module package structure

An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.

Microelectromechanical systems (MEMS) variable optical attenuator

Disclosed are a multi-channel optical switch and a method for manufacturing the same. The multi-channel optical switch includes a supporter; an input terminal optical fiber fixed to the supporter for inputting an optical signal to be switched therethrough; multiple output terminal optical fibers fixed to the supporter for outputting the optical signal inputted through the input terminal optical fiber therethrough; multiple micro mirrors for reflecting the optical signal inputted through the input terminal optical fiber and then for directing the optical signal to a designated output terminal optical fiber among the multiple output terminal optical fibers; and multiple actuators respectively connected to the micro mirrors for adjusting the positions of the micro mirrors so that the optical signal is reflected by the micro mirrors.

Multi-channel optical switch and method for manufacturing the same

Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, optical fibers having an optical signal transmitting end and an optical signal receiving end, respectively, coaxially arranged on the substrate, a micro-electric actuator arranged on the substrate for providing a driving stroke along a direction perpendicular to an optical axis of the optical beam, at least one lever structure arranged on the substrate for receiving the driving stroke of the micro-electric actuator at a first end thereof and transferring an amplified displacement distance to an optical shutter through a second end thereof, an optical shutter arranged on the substrate and connected to the second end of the lever structure so as to be moved by the amplified displacement distance, thereby being displaced to an attenuation position of the optical beam.

Growing community of inventors

Seoul, South Korea

Suk Kee Hong