Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Suk-Hyeon Cho

Je-Gwang Yoo

Han-Seo Cho

Byung-Moon Kim

Tae Hoon Kim

Chang-Sup Ryu

Cheol Seong Hwang

Chang Sup Ryu

Yoong Oh

Jin Yong Ahn

Jee Soo Mok

Seok-Kyu Lee

Jong-Kuk Hong

Byung Kook Sun

Sung Kun Kim

Duck Young Maeng

Jin-Yong Ahn

Chang-Kyu Song

Ho Sik Jeon

Min-Sang Lee

Jong Suk Bae

Seon-Goo Lee

Ho-Sik Jun

A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Method of manufacturing component embedded printed circuit board

A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.

Component embedded printed circuit board

A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.

Package board and method for manufacturing thereof

A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

Printed circuit board with embedded capacitors therein and manufacturing process thereof

A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same

Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.

Method of manufacturing package substrate with fine circuit pattern using anodic oxidation

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Suwon-si, South Korea

Suk-Hyeon Cho