Lg Semicon Co., Ltd.

Suk Bin Han

Yun Jun Huh

Jae Jeong Kim

Sang Jun Choi

A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.

Semiconductor wafer cleaning apparatus and method

Semiconductor wafer cleaning apparatus

A method of manufacturing a semiconductor device, which is designed to enhance the characteristic of a dual-gate MOS by reducing the phase difference between two gate electrodes, includes the steps of: forming a first conductivity type substrate in which a portion to be first and second gate electrodes are defined; sequentially forming a gate insulating layer and a conductive coating on the substrate; ion-implanting first conductivity type impurities into the conductive coating of a portion where the first gate electrode will be formed; ion-implanting second conductivity type impurities into the conductive coating of a portion where the second gate electrode will be formed; selectively etching the conductive coating, leaving only a portion doped with the first and second conductivity type impurities, and forming the first and second gate electrodes; and forming impurity regions in the surface of the substrate on both sides of the first and second gate electrodes.

Method of manufacturing semiconductor device

A system and method for cleaning semiconductor wafers, includes an internal cleaning tank having an outlet and a cassette for holding wafers, and a device disposed near the outlet of the internal cleaning tank for releasing a cleaning solution so as to increase a flow rate of the cleaning solution by creating a spiral flow of the cleaning solution, an external cleaning tank having an intake through which the cleaning solution is supplied to clean the wafers in the internal cleaning tank, a circulating pipe for connecting the outlet to the intake, a circulating pump formed in the middle section of the circulating pipe to repeatedly circulate that cleaning solution, and a filter for filtering the used cleaning solution circulated by the circulating pump to return the cleaning solution to the internal cleaning tank through the intake. The device prevents contaminating materials from adhering to the semiconductor wafers by spirally drawing out the used cleaning solution from the internal tank.

System and method for cleaning a semiconductor wafer

A semiconductor wafer cleaning apparatus includes an internal cleaning tank having an inlet for introducing and an outlet for removing a cleaning solution, and an external cleaning tank surrounding the internal cleaning tank and having a plurality of inlets and outlets for introducing and removing the cleaning solution. First and second circulation pumps each disposed in the middle of the first and second circulation pipes for connecting the inlet and outlet of the internal cleaning tank with the plurality of inlets and outlets of the external cleaning tank are also provided. A baffle plate may also be disposed within the internal cleaning tank for fixing and separating a cassette having a plurality of wafers contained therein from the bottom of internal cleaning tank. A weight detector is preferably disposed on the baffle plate for detecting a weight heavier than a predetermined reference due to the pressing of the cassette, and a controller for controlling the first and second circulation pumps controls the cleaning operation in response to a detection signal from the weight detector. The semiconductor wafer cleaning apparatus can enhance the cleaning effect by efficiently removing contamination generated during a cleaning process.

A wafer wet treatment apparatus includes a first supply/discharge line, an outer bath connected to the first supply/discharge line, an inner bath within the outer bath, a second supply/discharge line connected to the inner bath, and at least one partition located on a portion of the inner bath.

Wafer wet treating apparatus

A wet-etch method which determines a desired etch-ending point includes the steps of providing an etchant solution in a bath, perform a wet-etch process by dipping a material to be etched in the bath, measuring a PH variation value of the etchant solution during the wet-etch process, calculating a thickness variation value of the material by using the measured PH variation value, and stopping the wet-etch process when the thickness variation value reaches a preset value.

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Chungcheongbuk-do, South Korea

Suk Bin Han