Kingfa Sci.&tech.co., Ltd.

Zhuhai Vanteque Specialty Engineering Plastics Co., Ltd.

Shanghai Kingfa Technology Development Co., Ltd

Shanghai Kingfa Sci.&tech.dvpt.co., Ltd.

Sujun Jiang

Xianbo Huang

Tongmin Cai

Nanbiao Ye

Min Cao

Huan Chang

Chuanhui Zhang

Mingqin Chen

Kun Yan

Qingfeng Yi

Kaijun Ning

Xia Yan

Jieming Long

Zhingqiang Jiang

Jiehong Mai

Mujun Huang

Liming Fan

Xueke Sun

Zhenguo Shi

Zhongpeng Xiao

Yuxiong Xing

A semiaromatic copolyamide resin and a polyamide molding composition consisting of the same are provided, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.

Semiaromatic copolyamide resin and polyamide molding composition consisting of the same

The present invention discloses a heat-resistant polyamide composition and application thereof. The composition comprises the following components in percentage by weight: 40% to 90% of heat-resistant polyamide resin, 5% to 35% of mineral fiber A, 0 to 35% of mineral filler B, 0.1% to 1% of light stabilizer, 0.1% to 1% of flow modifier and 0.1% to 1% of antioxidant. In the present invention, heat-resistant polyamide resin with the ratio of amine-terminated group and carboxyl-terminated group between 0.1 and 0.8 is selected to be matched with deformed glass fibers with an aspect ratio of 2 to 6, the mineral filler B and the flow modifier to obtain the heat-resistant polyamide composition. The heat-resistant polyamide composition not only has high initial whiteness, high reflectivity and excellent heat resistance, but also has good moldability and good dimensional stability; therefore, the heat-resistant polyamide composition is capable of being applied for preparing the reflecting supports for such light sources as LCD backlight of portable phones, computers, televisions and the like, as well as headlights of automotive vehicles, instrument panels and lighting appliances, etc.

Heat-resistant polyamide composition and application thereof

Growing community of inventors

Guangdong, China

Sujun Jiang