Micron Technology Incorporated

Sui Waf Low

Yong Poo Chia

Wei Zhou

Meow Koon Eng

Min Yu Chan

Bok Leng Ser

A microelectronic component package includes a plurality of electrical leads which are coupled to a microelectronic component and which have exposed lengths extending outwardly beyond a peripheral edge of an encapsulant. A plurality of terminals may be positioned proximate a terminal face of the encapsulant and these terminals may be electrically coupled to the same leads. This can facilitate connection of the microelectronic component to a substrate using the leads as a conventional leaded package. The terminals, however, can facilitate stacking of the leaded package with one or more additional microelectronic components, e.g., a BGA package.

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Singapore, Singapore

Sui Waf Low