Growing community of inventors

Rancho Mission Viejo, CA, United States of America

Suhyung Hwang

Average Co-Inventor Count = 4.62

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 10

Suhyung HwangJaehyun Yeon (18 patents)Suhyung HwangKun Fang (9 patents)Suhyung HwangRajneesh Kumar (7 patents)Suhyung HwangHong Bok We (6 patents)Suhyung HwangChin-Kwan Kim (6 patents)Suhyung HwangDarryl Sheldon Jessie (5 patents)Suhyung HwangJeahyeong Han (4 patents)Suhyung HwangHyunchul Cho (4 patents)Suhyung HwangMohammad Ali Tassoudji (2 patents)Suhyung HwangMilind Shah (2 patents)Suhyung HwangTaesik Yang (2 patents)Suhyung HwangChaoqi Zhang (2 patents)Suhyung HwangLi-Sheng Weng (1 patent)Suhyung HwangJeongil Jay Kim (1 patent)Suhyung HwangXiaoming Chen (1 patent)Suhyung HwangMina Iskander (1 patent)Suhyung HwangBoyu Tseng (1 patent)Suhyung HwangAmeya Galinde (1 patent)Suhyung HwangSuhyung Hwang (19 patents)Jaehyun YeonJaehyun Yeon (21 patents)Kun FangKun Fang (9 patents)Rajneesh KumarRajneesh Kumar (26 patents)Hong Bok WeHong Bok We (81 patents)Chin-Kwan KimChin-Kwan Kim (36 patents)Darryl Sheldon JessieDarryl Sheldon Jessie (19 patents)Jeahyeong HanJeahyeong Han (7 patents)Hyunchul ChoHyunchul Cho (4 patents)Mohammad Ali TassoudjiMohammad Ali Tassoudji (111 patents)Milind ShahMilind Shah (44 patents)Taesik YangTaesik Yang (13 patents)Chaoqi ZhangChaoqi Zhang (6 patents)Li-Sheng WengLi-Sheng Weng (19 patents)Jeongil Jay KimJeongil Jay Kim (11 patents)Xiaoming ChenXiaoming Chen (5 patents)Mina IskanderMina Iskander (3 patents)Boyu TsengBoyu Tseng (1 patent)Ameya GalindeAmeya Galinde (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Qualcomm Incorporated (19 from 41,572 patents)


19 patents:

1. 12300873 - Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods

2. 12293980 - Package comprising discrete antenna device

3. 12126071 - Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods

4. 12125742 - Package comprising a substrate with high density interconnects

5. 11869833 - Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same

6. 11823983 - Package with a substrate comprising pad-on-pad interconnects

7. 11764489 - Sub-module L-shaped millimeter wave antenna-in-package

8. 11735804 - Multi-core broadband PCB antenna

9. 11696390 - Systems for shielding bent signal lines

10. 11551939 - Substrate comprising interconnects embedded in a solder resist layer

11. 11545425 - Substrate comprising interconnects embedded in a solder resist layer

12. 11495873 - Device comprising multi-directional antennas in substrates coupled through flexible interconnects

13. 11439008 - Package with substrate comprising variable thickness solder resist layer

14. 11399435 - Device comprising multi-directional antennas coupled through a flexible printed circuit board

15. 11258165 - Asymmetric antenna structure

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