Samsung Electronics Co., Ltd.

Suhyun Park

Kyuhong Kim

Baehyung Kim

Jongmin Baek

Wookyung You

Jong Keun Song

Kyuhee Han

Deokyoung Jung

Jangho Lee

Kyungil Cho

Kyeongbeom Park

Youngihn Kho

Jongkeun Song

Seonghun Lim

Sungbin Park

A semiconductor device includes a first insulating layer disposed on a substrate, a first wiring disposed in the first insulating layer, a first insulating barrier layer disposed on the first insulating layer, an etch-stop layer disposed on the first insulating barrier layer and having an area smaller than an area of the first insulating barrier layer in a plan view, a resistive metal pattern disposed on the etch-stop layer, a second insulating barrier layer disposed on the resistive metal pattern, a second insulating layer covering the first and second insulating barrier layers, a second wiring disposed in the second insulating layer, and a first conductive via disposed between the resistive metal pattern and the second wiring to penetrate through the second insulating barrier layer and the second insulating layer and electrically connect the resistive metal pattern and the second wiring.

Semiconductor device and method of manufacturing semiconductor device

There are provided an ultrasonic imaging apparatus, an ultrasonic probe apparatus, a signal processing apparatus, and a method for controlling an ultrasonic imaging apparatus. The ultrasonic imaging apparatus may include at least one first ultrasound element installed in a first ultrasound element installation unit; at least one second ultrasound element installed in a second ultrasound element installation unit that is separate from the first ultrasound element installation unit and such that the second ultrasound element forms a gap with the first ultrasound element; and a processor configured to estimate one or two or more virtual ultrasound signals that correspond to the gap based on a first ultrasound signal output from the at least one first ultrasound element and a second ultrasound signal output from the at least one second ultrasound element.

Ultrasonic imaging apparatus, ultrasonic probe apparatus, signal processing apparatus and method of controlling ultrasonic imaging apparatus

An ultrasound imaging apparatus includes an ultrasonic probe configured to transmit an ultrasound to an object, receive an echo signal reflected from the object, and output the echo signal; a quality determiner configured to receive the echo signals and determine quality of voxels of a three-dimensional (3D) volume of the object to be rendered based on observation information of the 3D volume; and a beamformer configured to perform beamforming on the echo signal based on the quality of the voxels to generate an output signal.

Ultrasound imaging apparatus and method for controlling the same

A beamforming apparatus includes: a signal output unit configured to output signals; a time difference corrector configured to correct a time difference between the signals; and a weight applier configured to apply a weight value to the signals, according to an error between the signals with the corrected time difference and a target delay pattern.

Beamforming apparatus, beamforming method, and ultrasonic imaging apparatus

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Hwaseong-si, South Korea

Suhyun Park