Seiko Epson Corporation

Suguru Uchiyama

Kosuke Takahashi

Hiroyuki Hosaka

Terunao Hanaoka

Nariya Takahashi

Takanori Fukuyama

Kazunari Sakamoto

Tomoaki Miyashita

Norikazu Kadotani

Minoru Moriwaki

Yoshitaka Hama

Yasuhiro Takeuchi

Toshizo Nishi

Katsunori Tanaka

An electro-optical device includes a first substrate, a second substrate bonded to the first substrate, a liquid crystal layer provided between the first substrate and the second substrate, a third substrate provided on an opposite side of the first substrate from the liquid crystal layer, and a frame configured to house the first substrate, the second substrate, and the third substrate. The frame includes a facing surface facing, via an adhesive layer, a first surface on an opposite side of the third substrate from the liquid crystal layer. The third substrate is larger than the first substrate. The frame and only the third substrate among the first substrate, the second substrate, and the third substrate are bonded to each other.

Electro-optical device and electronic apparatus

A light modulation device having a pixel arrangement region in which a plurality of pixels are arranged includes a first substrate, a second substrate disposed to be opposed to the first substrate via a liquid crystal layer, and a cooling member disposed on the opposite side of the first substrate with respect to the second substrate and thermally connected to the second substrate. The cooling member includes a hollow space in which working fluid is encapsulated and changes the working fluid in a liquid phase to the working fluid in a gas phase to cool the liquid crystal layer via the second substrate.

Light modulation device and projector

A projector according to the present disclosure includes a light source device, a plurality of light modulation devices, a combining prism, a support member, and a projection optical system. A first light modulation device includes a first light modulation panel having a first incident side substrate, a first exit side substrate, and a liquid crystal layer, a frame body which has a first opening part, and surrounds a side surface of the first incident side substrate and a side surface of the first exit side substrate, a second incident side substrate opposed to the first incident side substrate in the first opening part, an incident side member fixed to the second incident side substrate and the frame body, a support target member supported by the support member, and a holding member which is made elastically deformable.

Projector and liquid crystal panel module

A flexible wiring substrate includes a main substrate having flexibility, a main wiring disposed over the main substrate, a second protective sheet covering the main wiring, and an insulating member partially covering the main wiring exposed from the second protective sheet and being thinner in thickness than the second protective sheet.

Flexible wiring substrate, electro-optical device, and electronic apparatus

An electro-optical device includes a first drive IC and a second drive IC which are respectively mounted on a first flexible wiring substrate and a second flexible wiring substrate in a first mounting substrate and a second mounting substrate (first substrate). A first extension substrate and a second extension substrate (second substrate) which are configured by a flexible wiring substrate are connected to end portions of the first mounting substrate and the second mounting substrate, and a first protective film and a second protective film are attached to both surfaces in connection portions. The first protective film and the second protective film extend to positions covering the first drive IC and the second drive IC.

Electro-optical device having flexible wiring substrate, and electronic apparatus

An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.

Electro-optic device, electro-optic unit, and electronic apparatus

A first supply circuit outputs data signals to odd-numbered distribution circuits, and outputs selection signals to all of distribution circuits. A second supply circuit outputs data signals to even-numbered distribution circuits. The odd-numbered distribution circuits distribute the data signals to signal lines using the selection signals. The even-numbered distribution circuits distribute the data signals to signal lines using the selection signals. The first supply circuit outputs the data signals generated based on digital data signals which are basic signals of the data signals and an adjustment value, to the distribution circuits.

Electrooptical device, electronic apparatus, and method for driving electrooptical device

In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a cover section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.

Electro-optical device, manufacturing method thereof, and electronic apparatus

An electro-optic apparatus includes an element substrate, a pixel region including a first and second pixel formed on the element substrate, a first terminal formed on the element substrate, a second terminal formed on the element substrate, located opposite of the pixel region with the first terminal being interposed between the pixel region and the second terminal, a first wiring extending from the first terminal included in a path for transmitting to the first pixel, a first signal having been input to the first terminal and a second wiring extending from the second terminal included in a path for transmitting to the second pixel, a second signal having been input to the second terminal. Further, a difference between a resistance of the path for transmitting the first and second signal is made smaller than a resistance difference due to a difference between a length of the first and second wiring.

Electro-optic apparatus and electronic device

An electro-optic device includes an interconnection board provided with an internal terminal, and a chip mounted on the interconnection board, and the chip is provided with a mirror, a drive element, and a chip-side terminal electrically connected to the drive element. The interconnection board includes a first surface on which an internal terminal is disposed, a second surface located on an opposite side to the first surface, a third surface connecting the first surface and the second surface to each other, and a fourth surface located on an opposite side to the third surface. The interconnection board is provided with a metal member exposed on the first surface and the second surface, and through holes (a first through hole and a second through hole) extending from the third surface to the fourth surface and having contact with the metal member.

Electro-optic device, eletro-optic unit, and electronic apparatus

In an electro-optical device, a mirror and the like which is formed on an element substrate is sealed using a sealing member. The sealing member is provided with a frame section and a coyer section. In addition, the sealing member is provided on one face of the element substrate so that the mirror is surrounded by the element substrate and the sealing member and such that the mirror is positioned between a portion of the cover section and the element substrate. The sealing member is formed of a light-transmitting member having a frame section and a cover section which are integrally formed, and there is no interface between the frame section and the cover section.

Growing community of inventors

Suwa, Japan

Suguru Uchiyama