Sumitomo Precision Products Co., Ltd.

Suguru Takahashi

Yasuhiro Fujita

Eiji Togo

Tatsuya Morikawa

Munehisa Yamakoshi

An object of the present invention is to provide a diffusion bonding heat exchanger with which it is possible to reduce a thermal stress that is generated due to heat exchange between fluids significantly different from each other in temperature even in a case where the number of stacked heat transfer plates is made large. A diffusion bonding heat exchanger () includes a core () in which a plurality of heat transfer plates (HP) are stacked and diffusion-bonded to each other. The core includes a plurality of flow path blocks () each of which is configured to include a plurality of flow path layers () and a partition wall layer () that divides the plurality of flow path blocks. A thickness (t) of the partition wall layer in a stacking direction is larger than an interval (t) between flow paths arranged in the stacking direction.

Diffusion bonding heat exchanger

A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.

A heat exchanger includes a first flow path through which a first fluid flows, a second flow path through which a second fluid flows, and an adjustment layer disposed between the first flow path and the second flow path adjacent to each other and that adjusts an amount of heat exchange between the first flow path and the second flow path. The adjustment layer includes a first portion and a second portion having a heat transfer performance lower than that of the first portion, and has a heat transfer performance varied depending on a position in the adjustment layer.

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Amagasaki, Japan

Suguru Takahashi