Tokyo Electron Limited

Suguru Enokida

Shinichi Hayashi

Akira Miyata

Nobuaki Matsuoka

Naruaki Iida

Masahiro Nakaharada

Tsunenaga Nakashima

Yuichi Douki

Masashi Tsuchiyama

Tsuyoshi Watanabe

Kousuke Yoshihara

Yoji Sakata

Taro Yamamoto

Katsuhiro Morikawa

Tatsuhiko Tsujihashi

Kazuki Matsushita

Hiroshi Tomita

Kazuhiro Takeshita

Tokutarou Hayashi

Eiichi Sekimoto

Makoto Hayakawa

Hideki Kajiwara

Seiji Nakano

Kenichi Shigetomi

Junnosuke Maki

Takeshi Saikusa

Hidekazu Kiyama

Yuuichi Yamamoto

Tatsuhei Yoshida

Takayuki Fukudome

Kazuto Umeki

Masami Akimoto

Hiroaki Inadomi

Hayato Tanoue

Toshinobu Furusho

Michiaki Matsushita

Akihiro Teramoto

Ikuo Sunaka

Shota Umezaki

Mitsuhiro Tanoue

Akira Murata

Takashi Uno

Kousei Ide

Mitsuteru Yano

Satoshi Ookawa

Takahiro Ookubo

Keisuke Sasaki

Kouji Kimoto

Yasunori Toyoda

Hiroki Harada

A substrate processing apparatus includes: a carrier block including carrier placement parts and configured to load/unload a substrate into/from a carrier; a processing block provided on one side of the carrier block to process the substrate; first and second carrier placement parts of the carrier placement parts and provided side by side in a front-rear direction in a plan view; substrate placement parts provided to be arranged step by step vertically on one side of a substrate transfer region formed between the first and second carrier placement parts; a first substrate transfer mechanism provided in the substrate transfer region to deliver the substrate between the carrier of the first carrier placement part and a first substrate placement part of the substrate placement parts; and a second substrate transfer mechanism for moving upward and downward so as to deliver the substrate between first and second substrate placement parts.

Substrate processing apparatus and substrate processing method

A substrate transfer device includes a substrate holder and a base to which the substrate holder is movably attached. The substrate holder includes first and second suction holes provided to be open in a placing surface, first and second protrusions disposed respectively in the first and second suction holes, and first and second supports provided respectively in the vicinity of the first and second suction holes so as to protrude upward from the placing surface. The first protrusion is pressed by a first elastic member toward an upward direction to protrude from the first suction hole such that the first protrusion blocks the first suction hole, and the second protrusion is pressed by a second elastic member toward an upward direction to protrude from the second suction hole such that the second protrusion blocks the second suction hole.

Substrate transfer device and substrate transfer method

A substrate processing apparatus includes multiple first substrate processing devices, one or more second substrate processing devices and a transfer unit. Each of the multiple first substrate processing devices is configured to process a substrate one by one. The one or more second substrate processing devices are configured to simultaneously process multiple substrates, which are processed in the multiple first substrate processing devices. The transfer unit is configured to simultaneously carry the multiple substrates, which are processed in the multiple first substrate processing devices, into a same second substrate processing device.

A substrate processing system configured to process a substrate includes a first modifying apparatus configured to form, in a combined substrate in which a front surface of a first substrate and a front surface of a second substrate are bonded to each other, an internal modification layer elongated within the first substrate in a plane direction from a center of the first substrate toward at least an edge portion of the first substrate as a removing target; a second modifying apparatus configured to form, within the first substrate, an edge modification layer elongated in a thickness direction of the first substrate along a boundary between the edge portion and a central portion of the first substrate; and a separating apparatus configured to separate a portion of the first substrate at a rear surface side, starting from the internal modification layer.

Substrate processing system and substrate processing method

A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

Holding pad for carrying substrate

A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.

Substrate processing apparatus and method of adjusting substrate processing apparatus

There is provided a substrate processing apparatus for processing a substrate, including: a storage part provided on an uppermost portion of the substrate processing apparatus and on which a substrate accommodation container for accommodating the substrate is placed; and a first transfer device configured to directly or indirectly deliver the substrate accommodation container between the storage part and a loading/unloading part, wherein the loading/unloading part is configured to place the substrate accommodation container thereon in the substrate processing apparatus and to load and unload the substrate into and from a processing part of the substrate processing apparatus, and the first transfer device is configured to deliver the substrate accommodation container with respect to an overhead hoist transport that moves above the substrate processing apparatus.

A treatment solution supply apparatus supplies a treatment solution to a solution treatment apparatus which applies the treatment solution to a substrate to perform a predetermined treatment. Plural solution treatment apparatuses are supply destinations of the treatment solution. The treatment solution supply apparatus includes: a sending unit common among the solution treatment apparatuses, the sending unit sends the treatment solution stored in a treatment solution supply source to each of the solution treatment apparatuses; and a control unit that controls the sending unit. The sending unit includes pumps that suck the treatment solution and load the treatment solution thereinto and send the loaded treatment solution. The control unit controls suction timing of each of the pumps so that one (or more) of the pumps becomes in a state capable of sending the treatment solution to the solution treatment apparatuses at all times.

Treatment solution supply apparatus and treatment solution supply method

An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

Substrate treatment system, substrate transfer method and computer storage medium

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Koshi, Japan

Suguru Enokida