Nichia Corporation

Suguru Beppu

Yoichi Bando

Takuya Nakabayashi

Hiroto Tamaki

Tsuyoshi Okahisa

Tadao Hayashi

Kunihiro Izuno

Teruhito Azuma

Takeshi Ikegami

Takuya Noichi

Tatsuya Kanazawa

A method of manufacturing a light-emitting deviceincludes a step of providing first phosphor sheets, a step of providing second phosphor sheets, a step of providing a light-emitting element, a selection step of selecting a combination of one of the first phosphor sheetsand one of the second phosphor sheetson the basis of a wavelength conversion characteristic of each of the first phosphor sheetsand a wavelength conversion characteristic of each of the second phosphor sheets, a step of obtaining a plurality of first phosphor piecesand a plurality of second phosphor piecesfrom the selected first phosphor sheetand the selected second phosphor sheet, and a step of disposing one of the first phosphor piecesand one of the second phosphor pieceson or above the light-emitting element

Method of manufacturing light-emitting device including phosphor pieces

A method of manufacturing a covering member includes: providing a first light-reflective member comprising a through-hole, the through-hole having first and second openings; arranging a light-transmissive resin containing a wavelength-conversion material within the through-hole; distributing the wavelength-conversion material predominantly on a side of the first opening of the through-hole within the light-transmissive resin; and after the step of distributing the wavelength-conversion material, removing a portion of the light-transmissive resin from a side of the second opening of the through-hole.

Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device

A light emitting device includes: a light emitting element; a wavelength conversion member disposed on or above an upper surface of the light emitting element; a light-transmissive member disposed on an upper surface of the wavelength conversion member; and a light reflective member disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, wherein an upper surface of the light reflective member is coplanar with an upper surface of the light-transmissive member, and wherein each of the upper surface of the light reflective member and the upper surface of the light-transmissive member is a cut surface.

Light emitting device

A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

Light emitting device and method for producing the same

A method of manufacturing a light emitting device includes: mounting a light emitting element on a board; forming a cover layer that contains light reflecting material at a place on the board where the light emitting element is not positioned after the mounting of the light emitting element; and forming a phosphor layer that contains a phosphor by spraying on surfaces of the light emitting element and the cover layer after the forming of the cover layer.

Method for manufacturing light emitting device with phosphor layer

A light emitting device includes: a covering member including a first light-reflective member having a through-hole, and a light-transmissive resin disposed in the through-hole; a light-emitting element arranged to face the light-transmissive resin; a second light-reflective member arranged to face the first light-reflective member around the light-emitting element, the second light-reflective member covering a lateral surface of the light-emitting element; and a bonding member bonding the light-transmissive resin and the light-emitting element, the bonding member covering at least a part of the lateral surface of the light-emitting element. The light-transmissive resin contains a wavelength-conversion material distributed predominantly on either (i) a side of a lower surface of the light-transmissive resin facing the light-emitting element, or (ii) a side of an upper surface of the light-transmissive resin apart from the light-emitting element.

A method for manufacturing a light emitting device, having mounting a light emitting element on a board, forming a phosphor layer that contains a phosphor by spraying on surfaces of the board and the light emitting element after the mounting of the light emitting element; and forming a cover layer that contains at least one type of light reflecting material and light blocking material on a surface of the phosphor layer over the board.

A light emitting device includes a board, a light emitting element, a phosphor layer and a cover layer. The light emitting element is mounted on the board. The phosphor layer is in a substantially uniform thickness composed of a plurality of layers formed on a surface of the light emitting element. The cover layer contains light reflecting material at a place on the board where the light emitting element is not mounted. The cover layer covers the phosphor layer.

Light emitting device with phosphor layer

A light emitting device includes a light emitting element having electrodes on a lower surface side thereof; a phosphor layer covering a surface of the light emitting element; a transparent covering member disposed on at least one side surface of the light emitting device; and a reflection member that covers the covering member.

Light emitting device and method for manufacturing the same

A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a pair of connection terminals at least on an upper surface thereof. The connection terminals have an exposed portion exposed to outside, with the light emitting element electrically connected to the connection terminals. A covering member is disposed to cover at least a portion of the upper surface of the light emitting element, and a protective layer is disposed to cover at least a portion of the exposed portions of the connection terminals. The covering member is removed, and material from the upper surface side of the base member is supplied to dispose a light-transmissive member on the upper surface of the light emitting element. At least a portion of the light-transmissive member present on the protective layer is then removed.

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Anan, Japan

Suguru Beppu