Tdk Corporation

Suguru Andoh

Hitoshi Saita

Hiroshi Yamada

Tatsuo Namikawa

Yuuki Aburakawa

Tadashi Iino

Hiroshi Takasaki

Hayato Miyashita

Masahiro Hiraoka

Atsuo Matsutani

Kazuhito Uchida

Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second surfaces opposite to each other, a first capacitive electrode covering the first surface of the capacitive insulating film, and a second capacitive electrode covering the second surface of the capacitive insulating film and including a plurality of capacitor areas divided by a slit and a plurality of fuse areas connecting two of adjacent capacitor areas. The second capacitive electrode has a structure in which a plurality of conductor films including a first conductor film and a second conductor film lower in electrical resistivity than the first conductor film are laminated.

Thin film capacitor

A thin film capacitor is provided with a lower electrode made of a metal foil containing many metal grains, a dielectric thin film formed on an upper surface of the lower electrode, and an upper electrode formed on an upper surface of the dielectric thin film. A lower surface of the lower electrode is an etched surface from which cross sections of the metal grains appear. The height difference between the cross sections of adjacent metal grains in the etched surface is 1 &#x3bc;m or more and 8 &#x3bc;m or less.

Thin film capacitor, manufacturing method therefor, and substrate with built-in electronic component

Provided is a thin film capacitor that includes: a first electrode layer having a principal surface in which a plurality of recesses are provided; a dielectric layer laminated on the principal surface of the first electrode layer; and a second electrode layer laminated on the dielectric layer. When a depth of the recess is defined as FL and a thickness of the dielectric layer is defined as T, H/T is 0.05 or more and 0.5 or less.

A thermal head that includes a bonding portion and a protective layer. The thermal head prevents electrostatic discharge damage from occurring in the bonding portion of the thermal head due to the protective layer being electrostatically charged.

Growing community of inventors

Tokyo, Japan

Suguru Andoh