Nec Corporation

Sumitomo Bakelite Company Limited

Sumitomo Light Metal Industries, Ltd.

Sueo Morishige

Yoshio Sato

Toshiro Takeda

Yushi Sakamoto

Katsushi Terajima

Kenichi Kaneda

Fujio Shimizu

Takashi Suzuki

Harumi Mizunashi

Yuji Matubara

Shigetoshi Takasu

Semiconductor IC device comprises an IC chip fixed to a top surface of a carrier board having top electrodes located on a periphery of the top surface. The carrier board further includes bottom electrodes on a bottom surface each connected to corresponding one of the top electrodes by an interconnection formed within the carrier board. The bottom electrodes of the carrier board are electrically connected to and mechanically fixed to internal electrodes of a package container having pin grids each connected to corresponding one of the internal electrodes. The bottom electrodes are arranged in a matrix for standardized structure. Variety of types of inexpensive carrier boards are prepared to variety of IC chips so that the number of the types of expensive package containers is reduced and a stock cost thereof is significantly reduced.

Semiconductor integrated circuit device having an improved packaging

Heat-radiating fin for a heat sink

A resin paste for tight sealing, comprising

Resin paste for tight sealing

Growing community of inventors

Tokyo, Japan

Sueo Morishige