The Furukawa Electric Co., Ltd.

Suemi Tanaka

Masaaki Yamamoto

Yuichi Kimura

Junji Sotani

Takashi Murase

Kenichi Nanba

The present invention relates to a cooling unit for electronic devices wherein the manufacturing method comprises the steps of: (a) preparing a plate-type metal block for removing heat generated from an electronic component, the metal block having holes in the thickness part of the metal block and having convex portions formed on one main surface or both main surfaces of the metal block; (b) inserting heat pipes into the holes; and (c) applying a local and two-dimensional force from the surface of the metal block to the convex portions to make the surface flat bringing the outer surface of each heat pipe into close contact with the inner wall of each hole in the metal block.

Method for manufacturing cooling unit comprising heat pipes and cooling unit

Method for manufacturing cooling unit comprising heat pipes and cooling

A heat pipe type radiator is formed with a cooling plate mounted on an evaporative section of a heat pipe and a flat heat conductive plate mounted on a condenser section. Heat-generating electronic components are brought into contact with the cooling plate and a radiation fin molded from a thin plate in a wave form is mounted on both surfaces of the heat conductive plate. Other embodiments of the radiation fin include a skived fin formed by skiving a flat plate in an arch form, a pin fin and a wire fin which are composed of and so forth. Since each of these fins has the large surface area for heat radiation per unit volume and is small in weight, it is suitable to use for a heat pipe type radiator for an electronic apparatus. The heat generated in the electronic components transported to the heat conductive plate through the cooling plate and the heat pipe is radiated from the entire surface of the radiation fin to the ambient air. The heat conductive plate is molded in a flat form and, therefore, the heat generated in the electronic components can conduct to the portion most remote from the heat pipe. Further, since the radiation fin has a large surface area for heat radiation per unit volume, the heat radiation capability is improved.

Heat pipe type radiation for electronic apparatus

A heat pipe type cooling apparatus for a semiconductor, comprises a plurality of first copper pipes, each of the first pipes having a plurality of V-shaped grooves formed in an inner surface thereof and arranged in a circumferential direction thereof, and a plurality of second copper pipes, each of the second pipes having a plurality of second grooves formed in an inner surface thereof, each of the second grooves having an opening narrower than an inner part thereof. A plurality of ceramic pipes connect the first pipes and the second pipes, through intermediate pipes made of a nickel-iron alloy. One end of each of the second pipes is inserted in a metal block on which a semiconductor is mounted.

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Tokyo, Japan

Suemi Tanaka