Apple Inc.

Sudirukkuge T Jinasundera

Nathan K Gupta

Wei Lin

Prithu Sharma

Stephen Robert McClure

Zhibing Ge

Bryan W Posner

Ion Bita

Derek William Wright

Simon R Lancaster-Larocque

James E Pedder

Boyi Fu

Alfred Floyd Renaldo

Soyoung Kim

Tingjun Xu

Abhijit Ashok Kangude

Shubhaditya Majumdar

An-Chun Tien

Michael Vosgueritchian

Xiaonan Wen

Clayton Ka Tsun Chan

Christopher L Boitnott

Karan Bir

Prabhakar Gulgunje

Sang Un Choi

Weibo Cheng

Elmar Gehlen

Shenglin Ye

Shih-Wei Chang

Junhwan Lim

Ranjith Samuel E John

Myunghun Lee

Jie Fu

A system may include one or more electronic devices. Fiber bundles may be provided to convey light. A fiber bundle may have a bend along its length. Fibers for the fiber bundle may be formed from polymer cores coated with polymer claddings. The fibers may have end faces coated with antireflection coatings. The antireflection coatings may be formed from amorphous fluoropolymer deposited from solution. The fluoropolymer may be applied to the end faces of the fibers by dipping, spraying, or by dispensing with a needle dispenser or other dispensing tool. An optical component such as a light-emitting device for a communications system, an illumination system, or a sensor system may provide infrared light that is guided through the fiber bundle.

Systems having fibers with antireflection coatings

An electronic device may be provided with a display. An optical component window may be formed in the inactive area of the display. The optical component window may transmit infrared light from an infrared light source. The infrared light source may include a diffuser to allow the light source to operate in a flood illumination mode and a structured light mode. The diffuser may include liquid crystal material between first and second substrates. A sealant may surround the liquid crystal layer, and one or more spacer walls may be located between the sealant and the liquid crystal layer. An additional spacer wall may be used outside of the sealant to prevent metal from creating an electrical short between electrodes in the diffuser. Conductive material in the sealant may be used to couple a top electrode to a metal pad on a bottom substrate.

Electronic devices with switchable diffusers

A hybrid laser modulation and acid etch process for the creation of a patterned substrate. According to some embodiments, a hole is formed in a glass substrate by first modulating a portion of the substrate in the desired shape. A mask is coated on the glass substrate and is patterned to expose the modulated portion. The glass substrate is then acid etched to remove the modulated portion. Once the modulated portion has been etched, the desired shape may be removed from the glass substrate and the mask may be stripped.

Hybrid substrate processing

An electronic device may have a display. The display may be mounted in a housing and may have a window to accommodate a camera or other electrical component. The display may have multiple substrate layers. A hole may be formed in one of the substrate layers to form additional space within the housing to accommodate the electrical component. The hole may be drilled partway through a substrate layer to form an annular thinned region. The annular thinned region may be cracked to release a disk-shaped portion of the substrate layer and form the hole. A ring of sealant may surround the hole to help cushion the display substrate layers during drilling operations. Column spacer structures may be formed on a portion of a display substrate that is overlapped by the hole.

Electronic device displays with holes to accommodate components

Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical liquid. A laser is directed through the optical layer or optical liquid and a back side of the temporary substrate to decompose a portion of a process layer supported on a front side of the temporary substrate, followed by separation of the process layer and the temporary substrate.

Surface modification process for laser application

An electronic device may have layers of glass for forming components such as a display. A display cover glass layer may overlap an array of pixels. A touch sensor may be formed under the display cover glass layer. Conductive structures such as transparent conductive electrodes or other conductive layers of material may be formed on the outer surface of the display cover glass layer. The electrodes on the outer surface of the display cover glass layer may be coupled to metal contacts and other circuitry on the inner surface of the display cover glass layer using conductive vias. Vias may be provided with barrier layers, opaque coatings, tapers, and other structures and may be formed using techniques that enhance compatibility with chemical strengthening processes.

Electronic device display vias

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San Jose, CA, United States of America

Sudirukkuge T Jinasundera