International Business Machines Corporation

The Carborundum Company

Crystalline Materials Corporation

Other

Tessera Intellectual Properties, Inc.

Subhash Laxman Shinde

David B Goland

Benjamin V Fasano

Lester W Herron

Gregory M Johnson

Robert Hannon

Jonathan H Harris

Robert A Youngman

Andrew Michael Reitter

Carla Natalia Cordero

John Ulrich Knickerbocker

Jon Alfred Casey

Rao Venkateswara Vallabhaneni

Lisa M Studzinski

Frank Louis Pompeo

How Tzu Lin

Niranjan Mohanlal Patel

William Edward Sablinski

Richard A Bates

Takeshi Takamori

Johnathan Stephen Fish

David Clifford Long

Alan Frederic Benner

Sarah Huffsmith Knickerbocker

Kamalesh K Srivastava

Tien-Jen Cheng

Jonathan H Griffith

David E Eichstadt

Richard A Shelleman

Julie C Biggs

Lawrence Alfred Clevenger

Louis L Hsu

Evan G Colgan

Mark Vincent Pierson

Lawrence Jacobowitz

Eugen Schenfeld

Roger Allan Quon

David L Edwards

Sushumna Iruvanti

Sudipta Kumar Ray

Mario John Interrante

Steven Paul Ostrander

Joseph Francis Shepard, Jr

Srinivasa S Reddy

Raed A Sherif

Ronald Pete Luijten

Dinesh Gupta

Giulio DiGiacomo

Brenda Lee Peterson

Peter Richard Duncombe

David J Womac

Stephen S Drofitz, Jr

Larry D Gross

Mukta G Farooq

Sampath Purushothaman

Govindarajan Natarajan

Hilton T Toy

Kamal Kumar Sikka

Jane M Shaw

Krishna Gandhi Sachdev

Sung Kwon Kang

Mark J LaPlante

Thomas Edward Lombardi

Mitchell S Cohen

John Harold Magerlein

Lisa Jeanine Jimarez

Robert Anthony Rita

Donald Rene Wall

Monty Montague Denneau

John J Ritsko

Daniel J Stigliani, Jr

Ajay Prabhakar Giri

Srinivasa S N Reddy

Dudley A Chance

Dale Curtis McHerron

Thomas K Worthington

Rao R Tummala

Vivek M Sura

L Wynn Herron

Martin E Klepeis

Sylvia M DeCarr

Robert W Law

Irvin Huseby

Roger A Quinn

A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

Manufacturable optical connection assemblies

Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Optical assemblies for transmitting and manipulating optical beams

A method for forming an interconnect structure for a semiconductor device includes defining a via in a passivation layer so as expose a top metal layer in the semiconductor device. A seed layer is formed over the passivation layer, sidewalls of the via, and the top metal layer. A barrier layer is formed over an exposed portion of the seed layer, the exposed portion defined by a first patterned opening of a first diameter, and a solder material is formed over the barrier layer using a second patterned opening of a second diameter. The second patterned opening is configured such that the second diameter is larger than the first diameter.

Forming robust solder interconnect structures by reducing effects of seed layer underetching

An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Method and apparatus for providing optoelectronic communication with an electronic device

A method for forming an interconnect structure for a semiconductor device includes defining a via in a passivation layer so as expose a top metal layer in the semiconductor device. A seed layer is formed over the passivation layer, sidewalls of the via, and the top metal layer. A barrier layer is formed over an exposed portion of the seed layer, the exposed portion defined by a first patterned opening. The semiconductor device is annealed so as to cause atoms from the barrier layer to diffuse into the seed layer thereunderneath, wherein the annealing causes diffused regions of the seed layer to have an altered electrical resistivity and electrode potential with respect to undiffused regions of the seed layer.

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

Semiconductor module with improved interposer structure and method for forming the same

An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

An optical-electronic package for an electronic device provides electrical connections to the electronic device and optical fiber connections to the electronic device. The package includes a high thermal conductivity base which has a pedestal to support and provide heat transfer connection to the electronic device. A seal band is formed on the base and a casing is bonded to the seal band. The casing has side feedthroughs for the electrical connections from the electronic device, and the casing has top feedthroughs or grooves for the optical fiber connections from the electronic device. A lid is hermetically sealed to the top of the casing. The lid has retractable means for forming a bend in the optical fibers to provide strain relief when the lid is placed on the casing. The retractable means for forming a bend in the optical fibers is retractable once the lid is sealed on the casing.

Optoelectronic package structure and process for planar passive optical and optoelectronic devices

A method wherein optical fibers in a silicon connector are joined to a second optical component. The silicon connector is etched back with a dry etchant that is highly preferential for silicon to thereby etch the silicon connector much more than the optical fiber. After etching, the optical fibers protrude beyond the silicon connector so that they may be easily joined to the second optical component. Also disclosed is an optical fiber assembly made according to this method.

Method of bonding optical fibers and optical fiber assembly

A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

Method of preventing solder wetting in an optical device using diffusion of Cr

A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.

X-ray printing personalization technique

Growing community of inventors

Cortlandt Manor, NY, United States of America

Subhash Laxman Shinde