Sandia Corporation

National Technology & Engineering Solutions of Sandia, LLC

Subhash L Shinde

Randolph R Kay

Paul Charles Galambos

Ronald Francis Renzi

Todd Bauer

Darwin K Serkland

Mark S Derzon

Gregory Robert Bogart

Robert L Jarecki, Jr

Liam D Claus

Seethambal S Mani

David V Campbell

Thomas M Gurrieri

Dahwey Chu

John Teifel

Jeffrey L Rienstra

Michael L Holmes

Joy M Barker

Ronald P Kensek

Mark A Grohman

Thomas Kerr Lemp

Richard S Flores

An apparatus for detecting radiation is provided. In embodiments, at least one sensor is disposed on a surface of a wafer-like substrate. At least one sensor medium is fixed relative to the substrate, optically or electrically coupled to the sensor, and separated from the sensor by no more than the substrate thickness. An electronic signal-processing circuit is connected to the sensor and configured to produce an output when the sensor is stimulated by a product of an interaction between the sensor medium and impinging radiation. The sensor is configured to collect, from the sensor medium, charge and/or light produced within the sensor medium by interactions with impinging radiation.

Compact radiation detector

A 3D stacked sASIC is provided that includes a plurality of 2D reconfigurable structured structured ASIC (sASIC) levels interconnected through hard-wired arrays of 3D vias. The 2D sASIC levels may contain logic, memory, analog functions, and device input/output pad circuitry. During fabrication, these 2D sASIC levels are stacked on top of each other and fused together with 3D metal vias. Such 3D vias may be fabricated as through-silicon vias (TSVs). They may connect to the back-side of the 2D sASIC level, or they may be connected to top metal pads on the front-side of the 2D sASIC level.

Three-dimensional stacked structured ASIC devices and methods of fabrication thereof

A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

Focal plane array with modular pixel array components for scalability

Growing community of inventors

Albuquerque, NM, United States of America

Subhash L Shinde