Tokyo Electron Limited

Veeco Instruments Inc.

Subhadra Gupta

Tugrul Yasar

Israel Wagner

Ira Reiss

Wei Xiong

Rajendrapura Seetharamaiya Krishnaswamy

A method and apparatus for monitoring and controlling reactive sputter deposition, particularly useful for depositing insulating compounds (e.g., metal-oxides, metal-nitrides, etc.). For a given nominal cathode power level, target material, and source gases, the power supplied to the cathode (target) is controlled to stabilize the cathode (target) voltage at a specified value or within a specified range corresponding to a partial pressure or relative flow rate value or range of the reactive gas. Such an operating point or range, characterized by a specified voltage value or range and corresponding reactive gas relative-flow/partial-pressure value or range, may be determined empirically based on measuring the cathode voltage as a function of reactive gas relative-flow/partial-pressure for the given nominal power. This relationship is typically a hysteresis curve, and preferably the operation point is selected at or near the hysteresis transition edge to provide high rate deposition of high quality films, including insulating or dielectric films using a metallic target.

Stable high rate reactive sputtering

Method and apparatus for forming the longitudinal edges of stacks of razor blades by conveying the stacks of razor blades along a conveying path in a vacuum chamber past material deposition and material etching stations. The material etching stations are mounted in the sides of the vacuum chamber to be directed generally toward the edge sides of the edges of the razor blades. In another embodiment, stacks of razor blades are mounted on opposite sides of a rotating pallet and material deposition and etching stations are mounted in both side walls of the vacuum chamber. A DC or RF bias is applied to the stacks of razor blades by capacitively coupling the RF bias or conducting by electrical contacts a DC or RF bias to a central portion of the rotating pallet.

Process equipment with simultaneous or sequential deposition and etching

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Valley Cottage, NY, United States of America

Subhadra Gupta