Samsung Electronics Co., Ltd.

Su-Yong An

Woo-sung Lee

Sang-Ho Park

Sang-ho Park

Min-Sung Kil

Hee-Jong Kim

Suck-Hyun Nam

Gun-Bae Kim

Hyo-Jae Bang

Hyun-Seok Choi

Sung-Ki Lee

Yong-Hyun Kim

Chunghyun Ryu

Young-sang Cho

Chung-Hyun Ryu

Hyung-Mo Hwang

Hyoung-Taek Lim

Jong-Wook Jeong

Teck Su Oh

Insub Kwak

Jae-woong Choi

Sung-ki Lee

Byung-ok Kang

Jongwoo Jang

Byungok Kang

Geurim Jung

A storage device includes nonvolatile memory devices that store data, a storage controller, and an adaptive power supply circuit. The storage controller controls the nonvolatile memory devices. The adaptive power supply circuit generates at least one operation voltage based on at least one power supply voltage, and provides the at least one operation voltage to the nonvolatile memory devices and the storage controller. The at least one power supply voltage is provided to the adaptive power supply circuit through a portion of power lines connected to a host. Under control of the storage controller, the adaptive power supply circuit adaptively activates a power disable function associated with a provision of the at least one operation voltage according to a level of a third power supply voltage provided through a third power line of the plurality of power lines. The third power supply voltage is provided by the host.

Storage devices, storage systems and methods of operating storage devices

A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.

Horizontally mounted capacitor module and electronic device including same

Power management apparatuses are provided. A power management apparatus includes a secondary power device that includes at least one capacitor. The power management apparatus includes a charging circuit that includes a direct current (DC)-DC converter and that is configured to supply power to the secondary power device. Moreover, the power management apparatus includes a measuring circuit that is configured to measure a switching profile of the DC-DC converter, and to determine a state of the secondary power device by comparing at least one time period of the switching profile with a reference time. Related memory systems and methods of operation are also provided.

Memory systems and power management apparatuses including secondary power devices, and related methods of operation

Provided are an auxiliary power supply test method and an electronic apparatus to which the same is applied. The auxiliary power supply test method includes: applying a charging disable signal, which interrupts a charging operation by an auxiliary power supply unit for a predetermined period of time, to the auxiliary power supply unit; monitoring a charging voltage of the auxiliary power supply unit in a time interval in which the charging disable signal is applied to the auxiliary power supply unit; determining whether the auxiliary power supply unit is defective, based on whether the monitored charging voltage is less than a predetermined threshold voltage, wherein the auxiliary power supply unit supplies auxiliary power, obtained based on the charging voltage, to a system power supply line in a case of a sudden power-off.

Auxiliary power supply test methods and electronic apparatus using the same

A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

Semiconductor memory module with reverse mounted chip resistor

Growing community of inventors

Asan-si, South Korea

Su-Yong An