Samsung Electronics Co., Ltd.

Su-Yeon Doo

Young-Sik Kim

Sang-Uhn Cha

Ye-Sin Ryu

Kwang-il Park

Tae-Young Oh

Seung-Jun Bae

Young-Soo Sohn

Young-Ju Kim

Cheol Su Kim

Yong-Hun Kim

Dong-Seok Kang

Hye-Jung Kwon

Geun-tae Park

An error detection code generation circuit of a semiconductor device includes a first cyclic redundancy check (CRC) engine, a second CRC engine and an output selection engine. The first CRC engine generates first error detection code bits using a first generation matrix, based on a plurality of first unit data and first DBI bits in response to a mode signal. The second CRC engine generates second error detection code bits using a second generation matrix, based on a plurality second unit data and second DBI bits, in response to the mode signal. The output selection engine generates final error detection code bits by merging the first error detection code bits and the second error detection code bits in response to the mode signal. The first generation matrix is the same as the second generation matrix.

Error detection code generation circuits of semiconductor devices, memory controllers including the same and semiconductor memory devices including the same

A memory device includes an output pin, a mode register, a signal generator configured to generate a detection clock output signal including one of a random data pattern and a hold data pattern in response to first and second control signals from the mode register, and output the detection clock output signal through the output pin. The random data pattern includes pseudo-random data generated by the memory device. The hold data pattern is a fixed pattern pre stored in the memory device. The detection clock output signal is used for a clock and data recovery operation.

Memory device including detection clock pattern generator for generating detection clock output signal including random data pattern

A memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes a plurality of dynamic memory cells. The memory controller controls the semiconductor memory device. The memory controller applies an auto-refresh command to the semiconductor memory device at each refresh interval of the semiconductor memory device such that the semiconductor memory performs a refresh operation in a normal mode, and does not apply the auto-refresh command to the semiconductor memory device during a self-refresh interval in which the semiconductor memory performs a self-refresh operation. After the semiconductor memory device exits from the self-refresh interval, the memory controller adjusts an application of the auto-refresh command in the normal mode by reflecting information of the self-refresh interval.

Memory systems that adjust an auto-refresh operation responsive to a self-refresh operation history

Provided is a method of refreshing a memory device by controlling a self-refresh cycle according to temperature. In the method, first self-refresh and second self-refresh are performed according to inner temperature of the memory device and a self-refresh cycle is controlled such that an all-bank-refresh (ABR) operation is not performed simultaneously with the start of the second self-refresh. The ABR operation is performed at the start of third self-refresh when the sum of a section of the first self-refresh in which the ABR operation is not performed and a section of the second self-refresh in which the ABR operation is not performed corresponds to a self-refresh cycle.

Refresh method of controlling self-refresh cycle with temperature

An integrated circuit device includes an external power supply input configured to be coupled to an external power supply and a digital circuit, such as a clock signal generator circuit, that generates noise at a power supply input thereof. The device further includes a replica load circuit and a power supply circuit coupled to the external power supply input, to a power supply input of the digital circuit and to a power supply input of the replica load circuit. The power supply circuit is configured to selectively couple the external power supply node to the power supply input of the digital circuit responsive to a voltage at the power supply input of the replica load circuit. The replica load circuit may be configured to provide a load that varies responsive to a voltage at the power supply input of the digital circuit.

Integrated circuit devices using power supply circuits with feedback from a replica load

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Su-Yeon Doo