Industrial Technology Research Institute

Su-Tsai Lu

Yao-Sheng Lin

Yuan-Chang Huang

Sheng-Feng Chung

Shyh-Ming Chang

Shu-Ming Chang

Shu-Yi Chang

Chun-Ting Liu

Chen-Kun Chen

Bao-Shun Yau

Hsien-Chie Cheng

Cheng-Yi Shih

Heng-Tien Lin

Yu-Min Lin

Wen-Yung Yeh

Kuo-Hua Tseng

Yi-Ming Chang

Tai-Hung Chen

Tai-Hong Chen

Jing-Ye Juang

Chau-Jie Zhan

Yun-Chiao Chen

Wen-Hwa Chen

Tao-Chih Chang

Jing-Yao Chang

Shih-Ming Lin

Ji-Cheng Lin

Jyun-Kai Ciou

Chia-Sheng Huang

Ching-Chih Wei

Tsung-Fu Yang

Yu-Ling Hsieh

Yu-Jie Wei

A mesh electrode, a sensing device and an electrode layer are provided, in which the sensing device includes the mesh electrode. The mesh electrode is formed by a plurality of grid lines intersecting and connected to each other. The grid line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion. The electrode layer includes a plurality of conducting lines. The conducting lines have at least three line widths or at least three spaces. An appearing probability of each line width may be identical in the electrode layer. An appearing probability of each space may be identical in the electrode layer. The conducting line has a bottom surface and a cross-section, and the cross-section is perpendicular to the bottom surface and has at least one curved portion.

Mesh electrode, sensing device, and electrode layer

In one embodiment, a conductive line structure includes a substrate and a plurality of conductive lines thereon. The substrate has a first area and a second area, and the two areas are separated by at least one borderline. The plurality of conductive lines are disposed at the first area and the second area of the substrate, respectively. The at least one borderline may be a straight line, and the conductive lines disposed at the second area are inclined relative to the at least one borderline. A sensing device using the conductive line structure is also provided.

Conductive line structure and sensing device using the same

A sensing structure includes a sensing unit, a periphery circuit, and a connecting circuit. The connecting circuit connecting the sensing unit and the periphery circuit includes a connecting pattern. In an embodiment, the connecting pattern has at least two line widths. The line width of a part of the connecting pattern connecting the periphery circuit is greater than the line width of a part of the connecting pattern connecting the sensing unit. In an embodiment, the connecting pattern includes a mesh pattern having at least two mesh densities. The mesh density of a part of the mesh pattern connecting the periphery circuit is greater than the mesh density of a part of the mesh pattern connecting the sensing unit. In an embodiment, the connecting circuit includes lines between and connecting a single sensing series of the sensing unit and a periphery wire of the periphery circuit.

Sensing structure

A touch panel and a manufacturing method thereof and a touch display panel are provided. The touch panel includes a substrate, at least one first conductive line, an insulating layer, and at least one second conductive line. The substrate has a sensing region and a periphery region. The first conductive line is disposed on the periphery region. The insulating layer is disposed on the periphery region and covers the first conductive line. The second conductive line is disposed on the periphery region. The first conductive line and the second conductive line are electrically insulated to each other. A portion of at least one second conductive line is disposed on the insulating layer located above the first conductive line.

Touch panel and manufacturing method thereof and touch display panel

A gravure printing system is provided. The gravure printing system includes a plate cylinder, an ink source, a cover blade, and a doctor blade. The plate cylinder has a circumferential surface with at least one groove. The ink source is adapted to provider an ink onto the circumferential surface of the plate cylinder. The cover blade is adapted to form an anti-drying layer on the plate cylinder from the ink. The doctor blade is adapted to contact the plate cylinder and fill the at least one groove with the ink. A point on the circumferential surface sequentially passes by the ink source, the cover blade, and the doctor blade as the plate cylinder rotates. A Young's modulus of a material of the cover blade is less than a Young's modulus of a material of the doctor blade. A method of using the gravure printing system is also provided.

Gravure printing system and method of using the same

A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.

Touch panel structure and fabrication method for the same

An illumination device includes an OLED panel, an electrode structure, and a control module. The OLED panel includes a light-emitting layer configured to emit a light beam. The electrode structure is overlaid on the OLED panel. The electrode structure includes a first touch electrode including at least two conductive portions, and the conductive portions of the first touch electrode are electrically connected to the other conductive portions. The control module is electrically connected to the OLED panel and the first touch electrode. The light-emitting layer further includes a light-emitting material, and a width of the light-emitting material is greater than half of a width of the first touch electrode.

Illumination device

An illumination device including a light-emitting panel, a touch panel, and a control module is provided. The light-emitting panel includes a light-emitting layer configured to emit a light beam. The touch panel is overlaid on the light-emitting panel, and includes a first touch electrode. The control module is electrically connected to the light-emitting panel and the touch panel. The light-emitting layer further includes a light-emitting material, and the width of the light-emitting material is greater than half of the width of the first touch electrode.

A chip stack structure taking a wafer as a stacking base and stacking chips thereon is provided. The chip stack structure is capable of achieving high density electrode bonding and breaking the bottleneck of requiring interposer to serve as a transferring interface in three dimensional chip package. The chip stack structure is easily fabricated and compatible with wafer level process, so as to reduce processing time and manufacturing cost. A method for fabricating the chip stack structure is also provided.

Chip stack structure and method for fabricating the same

A touch structure and a manufacturing method for the same are provided. The touch structure comprises first patterned electrodes, a second patterned electrode, a dielectric structure and a conductive bridge. The second patterned electrode is disposed between the first patterned electrodes, and separated from the first patterned electrodes. The dielectric structure is disposed on the first patterned electrodes and the second patterned electrode. The dielectric structure has a dielectric opening. The conductive bridge is disposed across the dielectric structure and extended in the dielectric opening. The first patterned electrodes are electrically connected to each other through the conductive bridge.

Touch structure and manufacturing method for the same

An electronic device comprises a substrate and a number of bump units over the substrate, wherein each of the bump units includes an electrically insulating bump-forming body extending in a first direction, and at least two conductive layers separated from each other on the electrically insulating bump-forming body, the at least two conductive layers extending in a second direction orthogonal to the first direction.

Electronic assembly having a multilayer adhesive structure

The invention provides an electronic device package structure and method of fabrication thereof. The electronic device package structure includes a chip having an active surface and a bottom surface. A dielectric layer is disposed on the active surface of the chip. At least one trench is formed through the dielectric layer. A first protection layer covers the dielectric layer and sidewalls of the trench. A second protection layer covers the first protection layer, filling the trench.

Electronic device package structure with a hydrophilic protection layer and method for fabricating the same

A semiconductor device and an assembling method thereof are provided. The semiconductor device includes a chip, a carrier, a plurality of first conductive elements and a plurality of second conductive elements. The chip has a plurality of first pads. The carrier has a plurality of second pads. The second pads correspond to the first pads. Each first conductive element is disposed between one of the first pads and one of the second pads. Each second conductive element is disposed between one of the first pads and one of the second pads. A volume ratio of intermetallic compound of the second conductive elements is greater than a volume ratio of intermetallic compound of the first conductive elements.

Semiconductor device and assembling method thereof

A wafer level molding structure including a first chip, a second chip and an adhesive layer therebetween is provided. The first chip includes a first back side, a first front side and a plurality of lateral sides, and a plurality of first front side bumps are disposed on the first front side. The second chip includes a second back side and a second front side, and a plurality of second back side bumps and second front side bumps are respectively disposed on the second back side and the second front side. A plurality of through electrodes are disposed in the second chip, and electrically connected the second back side bumps to the second front side bumps. Adhesive materials including a plurality of conductive particles cover the lateral sides, and electrically connect the second back side bumps with the first front side bumps.

Wafer level molding structure

A sealed joint structure of device includes a buffer bump layer, conductive joint portions and a sealed joint portion. The buffer bump layer disposed between a device and a substrate includes first parts and a second part surrounding the first parts. Each of the conductive joint portions includes a first electrode covering each of the first parts and a second electrode on the substrate, and each of the first electrodes is electrically connected to the second electrode. The sealed joint portion includes a joint ring located on the substrate and is jointed with the second part to form a hermetic space between the device and the substrate.

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Hsinchu, Taiwan

Su-Tsai Lu