Samsung Display Co., Ltd.

Su-Mi Moon

Chong-Guk Lee

Joo-Yeon Won

Dong-Wook Lee

Se-Hui Jang

Se-Hul Jang

Sang-Moon Moh

Seonmi Kim

Sehui Jang

Chongguk Lee

Sangmoon Moh

A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Chip on film package and display apparatus having ihe same

Chip on film package and display apparatus having the same

A curved display apparatus includes a curved display panel, a driver, a controller and a plurality of flexible substrates. The curved display panel extends in a tangential direction with respect to a first axis direction. The driver applies a driving signal to the curved display panel. The controller includes a curved printed circuit board extending in the tangential direction with respect to a first axis direction. The controller applies a control signal to the driver. The flexible substrates electrically connect the curved printed circuit board with the curved display panel. Each of the flexible substrates includes a first connection portion connected to the curved display panel, a second connection portion connected to the curved printed circuit board and a flexible substrate body connecting the first connection portion with the second connection portion. The flexible substrate body extends in a radial direction with respect to the first axis direction.

Curved display apparatus having radially extending flexible substrates and method of manufacturing the same

A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

Display apparatus and method of manufacturing the same

A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

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Yongin-si, South Korea

Su-Mi Moon