Growing community of inventors

Gunpo-si, South Korea

Su Mi Im

Average Co-Inventor Count = 6.08

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 21

Su Mi ImWan Jung Kim (3 patents)Su Mi ImYong Woo Hong (3 patents)Su Mi ImSang Jin Kim (2 patents)Su Mi ImChul Ho Jeong (2 patents)Su Mi ImChang Beom Chung (2 patents)Su Mi ImAh Ram Pyun (2 patents)Su Mi ImKi Sung Jung (2 patents)Su Mi ImKyoung Jin Ha (1 patent)Su Mi ImKi Tae Song (1 patent)Su Mi ImChang Bum Chung (1 patent)Su Mi ImHan Nim Choi (1 patent)Su Mi ImKi Seong Jung (1 patent)Su Mi ImSu Mi Im (4 patents)Wan Jung KimWan Jung Kim (3 patents)Yong Woo HongYong Woo Hong (3 patents)Sang Jin KimSang Jin Kim (56 patents)Chul Ho JeongChul Ho Jeong (41 patents)Chang Beom ChungChang Beom Chung (4 patents)Ah Ram PyunAh Ram Pyun (3 patents)Ki Sung JungKi Sung Jung (3 patents)Kyoung Jin HaKyoung Jin Ha (23 patents)Ki Tae SongKi Tae Song (5 patents)Chang Bum ChungChang Bum Chung (3 patents)Han Nim ChoiHan Nim Choi (1 patent)Ki Seong JungKi Seong Jung (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Cheil Industries Inc. (4 from 787 patents)


4 patents:

1. 8557896 - Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film

2. 8394493 - Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the same

3. 8211540 - Adhesive film composition, associated dicing die bonding film, die package, and associated methods

4. 7863758 - Adhesive film composition, associated dicing die bonding film, and die package

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idiyas.com
as of
12/9/2025
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