Samsung Electronics Co., Ltd.

Su-jung Hyung

Won-keun Kim

Kil-soo Kim

Kyung-suk Oh

Ji-Han Ko

Yeong-seok Kim

Hwa-il Jin

Joung-phil Lee

Hyun Yeul Lee

Hyun-ki Kim

Ji-sun Hong

Jin-gyu Kim

A semiconductor package may include a first semiconductor chip on and electrically connected to a wiring substrate, an intermediate layer on the first semiconductor chip and covering an entire surface of the first semiconductor chip, a second semiconductor chip on the intermediate layer and electrically connected to the wiring substrate, a mold layer on the wiring substrate and covering the first semiconductor chip and the second semiconductor chip, the mold layer including one or more inner surfaces defining a mold via hole that exposes a portion of a surface of the intermediate layer, an electromagnetic shielding layer on the one or more inner surfaces of the mold layer and further on one or more outer surfaces of the mold layer, and a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole.

Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics

Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB

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Seoul, South Korea

Su-jung Hyung