Samsung Electronics Co., Ltd.

Su-Jin Ahn

Su-Youn Lee

Gwan-Hyeob Koh

Chang-Wook Jeong

Se-Ho Lee

Yoon-jong Song

Jae-Hyun Park

Tae-young Kim

Yong-Seok Kim

Won-Cheol Jeong

Bong-jin Kuh

Sung-Il Chang

Jun-Hee Lim

Young-Nam Hwang

Sung-lae Cho

Kyung-Chang Ryoo

Jae-Sung Sim

Yoon-Moon Park

Chang-Min Choi

Ji-Yeong Hwang

Jang-Eun Lee

Yong-Ho Ha

Ji-Hye Yi

Soon-Oh Park

Hyeong-Geun An

Sang-Don Nam

Ju-Young Lim

Choong-Man Lee

Hyoung-Joon Kim

Hyung-joo Youn

Kyu-chul Kim

Jin-Ho Kim

Sang-Yong Park

Dong-Chan Kim

Ki-nam Kim

Jae-Kwan Park

Chang Wook Jeong

Dae-Won Ha

Kyung-Tae Nam

Dong-hwa Kwak

Jang-ho Park

Bong-Yong Lee

Kee-won Kwon

Jung-hyuk Lee

Fai Yeung

Jue-Hwang Sim

Young-nam Hwang

Sang-Hyun Hong

A vertical memory device includes a substrate, a plurality of channels extending in a first direction substantially vertical to a top surface of the substrate, a plurality of gate lines surrounding a predetermined number of channels from among the channels, a plurality of common wirings electrically connected to the gate lines, and a plurality of signal wirings electrically connected to the gate lines via the common wirings. The gate lines are arranged and spaced apart from one another along the first direction. Each common wiring is electrically connected to a corresponding gate line at a same level of the corresponding gate line via a corresponding contact.

Vertical memory devices

A method of programming a non-volatile memory includes executing at least two program loops on memory cells in a selected word line, generating a fail bit trend based on a result of executing each of the at least two program loops, predicting a plurality of program loops comprising an N program loop to be executed last on the memory cells, based on the generated fail bit trend, and changing, based on a result of predicting the plurality of program loops, a level of an N program voltage provided to the memory cells when the N program loop is executed.

Non-volatile memory device and program method of a non-volatile memory device

In a method of manufacturing a vertical semiconductor device, an insulation layer and a sacrificial layer are alternatively and repeatedly formed on a substrate to define a structure. The structure is etched to form a hole therethrough that exposes the substrate. A first semiconductor pattern is formed in a lower portion of the hole, and a blocking pattern, a charge storage pattern, a tunnel insulation pattern and a first channel pattern are formed on a sidewall of the hole. A second channel pattern is formed on the first channel pattern and the semiconductor pattern, and a second semiconductor pattern is formed on a portion of the second channel pattern on the semiconductor pattern to define an upper channel pattern including the second channel pattern and the second semiconductor pattern. The sacrificial layers are replaced with a plurality of gates, respectively, including a conductive material.

Vertical semiconductor devices and methods of manufacturing the same

In a method of writing data in an MRAM device, a first operation unit is selected in a plurality of memory cells of the MRAM device. First to n-th switching pulses are sequentially applied to the first operation unit to write data in first to n-th groups of memory cells of the first operation unit, respectively. The n-th switching pulse may have a current level lower than that of an (n&#x2212;1)th switching pulse, where n is an integer larger than at least 1. The n-th switching pulse may have a pulse width narrower than that of an (n&#x2212;1)th switching pulse, where n is an integer larger than at least 1. The technique can be repeated for a second operation unit. A device and system are disclosed in which different current switching pulses are applied to multiple groups of memory cells within the first and/or second operation units.

Magnetic random access memory device and method of writing data therein

A method of manufacturing a semiconductor device includes providing a wafer, forming a memory device which includes phase change material layer on the wafer, completing a wafer level process of manufacturing the semiconductor device, and performing a thermal treatment process on the wafer to densify the phase change material. To this end, the process temperature of the thermal treatment is higher than the crystallization temperature of the phase change material and lower than the melting point of the phase change material.

Methods of fabricating semiconductor device

A non-volatile memory device can include a plurality of parallel active regions that are defined by a plurality of device isolation layers formed on a semiconductor substrate, where each of the plurality of parallel active regions extends in a first direction and has a top surface and sidewalls. A plurality of parallel word lines can extend in a second direction and cross over the plurality of parallel active regions at intersecting locations. A plurality of charge storage layers can be disposed at the intersecting locations between the plurality of parallel active regions and the plurality of parallel word lines. Each of the plurality of charge storage layers at the intersecting locations can have a first side and a second side that is parallel to the second direction and can have a first length, a third side and a fourth side that are parallel to the first direction and can have a second length, where the first length is less than the second length.

Non-volatile memory devices having charge storage layers at intersecting locations of word lines and active regions

A phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation. In one embodiment, a semiconductor memory device includes a molding layer disposed over semiconductor substrate, a phase-changeable material pattern, and an oxidation barrier of electrically insulative material. The molding layer has a protrusion at its upper portion. One portion of the phase-changeable material pattern overlies the protrusion of the molding layer, and another portion of the phase-changeable material pattern extends through the protrusion. The electrically insulative material of the oxidation barrier may cover the phase-changeable material pattern and/or extend along and cover the entire area at which the protrusion of the molding layer and the portion of the phase-change material pattern disposed on the protrusion adjoin.

Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same

Nonvolatile memory devices are provided. Devices include active regions that may be defined by device isolation layers formed on a semiconductor substrate and extend in a first direction. Devices may also include word lines that may cross over the active regions and extend in a second direction intersecting the first direction. The active regions have a first pitch and the word lines have a second pitch that is greater than the first pitch.

Non-volatile memory devices having improved operational characteristics

A memory cell transistor of a DRAM device is provided. A gate stack pattern is formed on a semiconductor substrate. A DC node and a BC node are formed substantially under lateral sides of the gate stack pattern in the semiconductor substrate. The DC node and the BC node are being electrically connected to a bit line and a storage electrode of a capacitor, respectively. A first source/drain junction region is formed under the DC node and a second source/drain junction region is formed under the BC node. The first source/drain junction region has a profile which is different from that of the second source/drain junction region.

Memory cell transistor having different source/drain junction profiles connected to DC node and BC node and manufacturing method thereof

Phase-changeable memory devices include non-volatile memory cells. Each of these non-volatile memory cells may include a phase-changeable diode on a semiconductor substrate and a phase-changeable memory element having a first terminal electrically coupled to a terminal of the phase-changeable diode. This phase-changeable diode may include a lower electrode pattern on the semiconductor substrate, a first phase-changeable pattern on the lower electrode pattern and a gate switching layer pattern on the first phase-changeable pattern. The phase-changeable memory element includes a second phase-changeable pattern electrically coupled to the terminal of the phase-changeable diode and a memory switching layer pattern on the second phase-changeable pattern. The memory switching layer pattern may include a composite of a titanium layer pattern contacting the phase-changeable memory element and a titanium nitride layer pattern contacting the titanium layer pattern.

Methods of forming phase-changeable memory devices

In one embodiment, a phase-change memory device has an oxidation barrier layer to protect against memory cell contamination or oxidation and a method of manufacturing the same. In one embodiment, a semiconductor memory device comprises a molding layer overlying a semiconductor substrate. The molding layer has a protrusion portion vertically extending from a top surface thereof. The device further includes a phase-changeable material pattern adjacent the protrusion portion and a lower electrode electrically connected to the phase-changeable material pattern.

There are provided PRAMS having a plurality of active regions located vertically in sequence and methods of forming the same. The PRAM and the method provide an approach to rapidly changing phase in a phase change layer pattern with a given design rule. A semiconductor substrate defining at least one reference active region is prepared in a cell array region and a peripheral circuit region. Other semiconductor substrates on a vertical line passing a main surface of the reference active region are located in sequence. The other semiconductor substrates define other active regions, respectively. A lower cell gate pattern is formed on the semiconductor substrate of the reference active region, and upper cell gate patterns are disposed on the other semiconductor substrates of the other active regions, respectively.

PRAMS having a plurality of active regions located vertically in sequence and methods of forming the same

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Seoul, South Korea

Su-Jin Ahn