Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Su-ho Shin

Yong-soo Oh

Kyu-ho Shin

Chang-youl Moon

Tae-gyu Kim

Chang-hoon Jung

Dong-Woo Lee

Soon-cheol Kweon

Ki-hwan Kwon

Seung-tae Choi

Seung-ju Shin

Min-Soo Kim

Keon Kuk

Chang-seung Lee

Dong-jin Seol

Jong-woo Shin

Seog-Soon Baek

Ki-deok Bae

Hyung-taek Lim

Seog-soon Baek

Hwan-hee Kim

Tae-hoon Kim

Hwan-guem Kim

Seung-Joo Shin

You-seop Lee

Arthur Darbinian

Jae-woo Chung

Jin-Won Lee

Kwang Hyun Kim

Jin-woo Cho

Youn-gun Jung

Young-min Cheong

Jin-seung Choi

Sung-gyu Kang

Seong-taek Lim

Seung-Tae Choi

Kyong-il Kim

Seung-mo Lim

Seong-woon Booh

Su-gun Kim

Sung-hee Lee

Hae-seog Jo

Jong-min Wang

Ji-hyuk Lim

Kyung-sik Shin

Young-bin Lee

Tetsuo Ando

Yong-Ung Ha

A fixing unit and an image forming apparatus including the fixing unit. The fixing unit includes a heating roller having an internal space in which a heating source is disposed and a pressurizing roller facing the heating roller. The heating roller has a circular hollow pipe shape and includes a fixing nip forming part which forms a fixing nip between the fixing nip forming part and the pressurizing roller. The nip forming part can have a slim part disposed at a center thereof and a pair of deformation preventing parts formed at both ends of the slim part, each deformation preventing part having a thickness thicker than a thickness of the slim part.

Reduced thickness fixing unit to reduce deformation or fatigue failure

An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

LED package structure and manufacturing method, and LED array module

An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

LED package and fabrication method thereof

A fusing device includes a rotatable pressing roller, a fusing belt to rotate by a rotational force transmitted from the rotatable pressing roller, a nip forming member to contact an inner surface of the fusing belt to form a nip on a contact area between the rotatable pressing roller and the fusing belt, a heating member formed in approximately an internal central portion of the fusing belt to heat the nip forming member and the fusing belt, an inner support member formed within the fusing belt to press a nip part of the nip forming member toward the rotatable pressing roller, and an outer support member formed outside the fusing belt, and both ends of the outer support member being engaged with the inner support member to thereby reinforce the strength of the inner support member and form a path for radiation heat to disperse. The support unit includes an inner support member placed within the belt unit, and an outer support member placed outside the belt unit, both ends of the outer support member being engaged with the inner support member to reinforce the strength of the inner support member and to form a path for a radiation heat to disperse.

Fusing device and image forming apparatus having the same

A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

LED array module

A fusing apparatus includes a heating unit to generate heat to fuse an image onto a printing medium, a pressurizing roller that faces and contacts the heating unit having an endless fusing film that is rotated while facing and contacting the pressurizing roller and presses the printing medium toward the heating unit, a nip forming member including a main body formed inside the fusing film to surround a heat source and contacts a portion of the fusing film to the pressurizing roller to form a nip. The fusing apparatus further includes a supporting member to support the nip forming member.

Fusing apparatus and electrophotographic image-forming apparatus having the same

A fixing device includes a fixing roller, a fixing belt which is made to rotate by a rotation force received from the fixing roller, a nip forming unit to form a nip zone at a contact area between the fixing roller and the fixing belt, and a first heating unit, which is separated from the nip zone, to apply heat to the fixing belt. The nip zone and the heating unit are separated, so that the heating unit can be prevented from being broken as a result of the pressurization and thermal deformation.

Fixing device and image forming apparatus having the same

A fusing device includes a pressure unit, a belt unit to rotate in outer contact with the pressure unit, a nip forming unit to form a nip over a contact portion between the pressure unit and the belt unit, a heating unit to heat the nip forming unit and the belt unit, and a support unit to press and support the nip forming unit constantly and having a plurality of heat transmission portions defined in a parallelogrammic shape of an oblique direction with respect to a traveling direction of the belt unit.

A fusing device includes a pressing member, a belt member to rotate in contact with the pressing member, a nip forming member to support the belt member so that nip areas are formed on the pressing member and the belt member at contacting portions thereto, a heating member disposed away from the nip areas, to heat the belt member, and a tension application member to stiffen the belt member so that the heating member is tightly contacted with the belt member. The heating member includes a plate type heating element which is arranged at an upstream side of the nip areas, and to contact an inner circumference of the belt member, in an advancing direction of the fusing belt. The effective width of then nip areas increases, and the increased pressure is exerted to the nip areas, because the fusing belt enters a location where the nip areas are formed in a heated state. Furthermore, heating efficiency of the fusing belt is increased, because the fusing belt is heated while in a tight contact with the heating member. As a result, fusing performance is enhanced.

A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Backlight module including at least one luminescence element, and method of fabricating the same

A fixing device includes a pressing roller, a fixing belt to receive a rotation force transferred from the pressing roller and to rotate thereby, a nip forming member which is mounted inside the fixing belt, the nip forming member including a heat transmission unit formed thereon, and a heat source, which is mounted inside the nip forming member, to simultaneously apply heat to the nip forming member and to the fixing belt through the heat transmission unit.

A lighting device is provided. The lighting device includes a light source, a light source supporting member which has a surface to which the light source is attached, and a heat sink on an opposite surface of the light source supporting member, for dissipating heat generated by the light source. In addition, the heat sink includes a heat transfer member which protrudes from the surface of the light source supporting member; a plurality of first fins which are spaced apart from each other at intervals in a length direction of the heat transfer member, and are arranged parallel to the light source supporting member; and a plurality of second fins which are spaced apart from each other at intervals, surround outer portions of the first fins, and are arranged perpendicularly to the light source supporting member.

Lighting device

Growing community of inventors

Seongnam-si, South Korea

Su-ho Shin