Kla Tencor Corporation

Stuart Sherwin

Mark Davis Smith

Ady Levy

Walter Dean Mieher

William Pierson

Onur Demirer

Jose Enrique Solomon

Hoyoung Heo

Jeremy Nabeth

Fatima Anis

Christian Sparka

Ramkumar Karur-Shanmugam

Choon (George) Hoong Hoo

A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller communicatively coupled to the detector. The controller is configured to measure alignment at a plurality of locations across the sample to generate alignment data, select an analysis area for alignment zone determination, divide the analysis area into two or more alignment zones having different alignment signatures; model the alignment data of at least a first alignment zone of the two or more alignment zones using a first alignment model, and model the alignment data of at least a second alignment zone of the two or more alignment zones using a second alignment model different than the first alignment model.

Systems and methods for automated multi-zone detection and modeling

The determination of in-plane distortions of a substrate includes measuring one or more out-of-plane distortions of the substrate in an unchucked state, determining an effective film stress of a film on the substrate in the unchucked state based on the measured out-of-plane distortions of the substrate in the unchucked state, determining in-plane distortions of the substrate in a chucked state based on the effective film stress of the film on the substrate in the unchucked state and adjusting at least one of a process tool or an overlay tool based on at least one of the measured out-of-plane distortions or the determined in-plane distortions.

Method and system for determining in-plane distortions in a substrate

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San Jose, CA, United States of America

Stuart Sherwin