Lockheed Martin Corporation

Stuart R Ducker

John Ditri

David R Helms

Dana Jay Sturzebecher

Marc Thomas Angelucci

Brian Alan Pluymers

Daniel W Harris

Richard Johann Heinrich

Thomas E McGuigan

John Fraschilla

Robert B Lewis

An integrated circuit amplifier comprises: a first planar substrate having an upper surface and a lower surface; a second planar substrate having an upper surface and a lower surface, the lower surface of the second planar substrate physically affixed to the upper surface of the first planar substrate; at least one transistor pair comprising a first and second transistor, formed in the upper surface of the second planar substrate; and a conductor electrically coupling a drain electrode of the first transistor to a source electrode of the second transistor. The first substrate material may have a higher thermal conductivity than the second substrate material. The first material may be Silicon Carbide and may have a thickness of about 10 mils. The second material may be Gallium Arsenide and may have a thickness of about 1 to 2 mils.

Integrated-circuit amplifier with low temperature rise

An integrated circuit comprises a GaAs substrate thermally and mechanically mounted on a SiC substrate. The GaAs substrate is doped to define first and second transistors. Circuit conductors are defined on the GaAs substrate, which conductors interconnect the source of the first transistor to neutral and the drain to the source of the second transistor. Conductors connect the gate of the second transistor to neutral, to define a cascode amplifier. The SiC substrate supports first and second matching circuits, one of which is connected to the gate of the first transistor, and the other of which is connected to the drain of the second transistor.

An element support and thermal control arrangement for an active array antenna, preferably modular, using line-replaceable units (LRUs), includes a radiating-side liquid-cooled cold plate lying parallel with a liquid-cooled TR coldplate. Antenna elements are supported and cooled by the radiating cold plate, and a beamformer lies between the radiating and TR coldplates. A plurality of column coldplates are attached to the rear of the TR coldplate and define bays or volumes in which power LRUs can be fitted in thermal communication with the TR coldplate, the column coldplates, or both.

Antenna with compact LRU array

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Hainesport, NJ, United States of America

Stuart R Ducker