Fusion Systems Corporation

Stuart N Rounds

John C Matthews

Michael G Ury

Robert D Wooten

David S Ferris

A method and apparatus for stripping a photoresist layer from a semiconductor wafer, wherein oxidizing gas is fed from the edge of the wafer to the center. The oxidizing gas may be directed so that it is incident on the heated wafer support platform before it is incident on the wafer.

Method for photoresist stripping using reverse flow

An apparatus for rapidly stripping a photoresist which utilizes an oxidizing fluid such as ozone. A very thin layer of oxidizing fluid of four millimeters or less is flowed over the photoresist. The fluid flows at high velocity over the resist, while the resist is heated. Additionally, the resist may be irradiated with ultraviolet radiation at an irradiance of at least about 800 milliwatts/cm.sup.2.

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Germantown, MD, United States of America

Stuart N Rounds