Adeia Semiconductor Bonding Technologies Inc.

Kestrel Solutions, Inc.

Fotonation Limited

Stuart E Wilson

Ilyas Mohammed

Belgacem Haba

Ronald Patrick Green

Hari Chakravarthula

Charles White

Wael Zohni

Masud Beroz

Yoichi Kubota

James F Coward

Peter H Chang

Jesse B Thompson

Ting K Yee

Michael W Rowan

Andy Stavros

Ming Tsai

Richard Dewitt Crisp

Minnie Ho

Giles Humpston

Norman L Swenson

James Gill Shook

Laurence J Newell

David Alan Pechner

Sridhar Krishnan

Roger Rong Taur

David B Upham

Abraham H Kou

Augustus Elmer

A device is provided with a housing adapted to engage a portion of a head of a user, such as the ear of the user. The device includes a camera component adapted to face in the same direction as the user when engaged with the portion of the head of the user. The device may be adapted to be controlled using voice commands from the user.

Wearable ultra-thin miniaturized mobile communications

A cellular telephone is provided with a wearable housing, desirably in a form which can be concealed in the user's clothing, wallet, or other place. The housing may be devoid of switches or buttons for controlling the cellular telephone, and control inputs can be provided through free space communications such as a short-range radio link. A module for use in portable communications devices includes chips superposed on one another on a stack, and incorporates an interposer for facilitating connections between the chips.

A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

Microelectronic package with thermal access

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

Microelectronic packages and methods therefor

A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

Stack microelectronic assemblies

An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

Assembly including vertical and horizontal joined circuit panels

A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

A phased antenna array is disclosed. The phased antenna array is composed of one or more modules and has a plurality of antenna. The array has a plurality of antenna configured to operate as an array and each module has at least one antenna. The modules have a substrate that supports the antenna, a microelectronic device for sending signals to or receiving signals from said antenna and conductive traces that connect that antenna to the microelectronic device. In those embodiments where the phased antenna array has more than one module, a common substrate supports the one or more modules. A combination of circuitry and interconnects achieves the desired electrical interconnection between the modules.

Phased antenna array module

A frequency division multiplexing (FDM) node used in optical communications networks provides add-drop multiplexing (ADM) functionality between optical high-speed channels and electrical low-speed channels. The FDM node includes a high-speed system and an ADM crosspoint. The high-speed system converts between an optical high-speed channel and its constituent electrical low-speed channels through the use of frequency division multiplexing and preferably also QAM modulation. The ADM crosspoint couples incoming low-speed channels to outgoing low-speed channels, thus implementing the ADM functionality for the FDM node.

Optical communications networks utilizing frequency division multiplexing

A system transmits digital data over an optical fiber at high aggregate data rates and high bandwidth efficiencies. The system includes a modulation stage, a frequency division multiplexer, and an optical modulator. The modulation stage QAM-modulates a plurality of incoming digital data channels. The frequency division multiplexer combines the QAM-modulated signals by frequency division multiplexing them into an RF signal. The optical modulator uses the RF signal to modulate an optical carrier for transmission over an optical fiber.

Growing community of inventors

Menlo Park, CA, United States of America

Stuart E Wilson