The University of Queensland

Nihon Superior Co., Ltd.

Stuart David McDonald

Tetsuro Nishimura

Kazuhiro Nogita

Takatoshi Nishimura

Tetsuya Akaiwa

Jonathan James Read

Tina Ventura

Shiqian Liu

In a method for manufacturing a solder joint part, at least one of a first metal base material and a second metal base material is an alloy containing Ni in an amount of more than 0 wt % and less than 44 wt % and Cu in an amount of more than 56 wt %, and solder is a solder alloy containing Ga and inevitable impurities or a solder alloy containing Ga as a main component and having a melting point of 30° C. or lower. The method includes applying the solder to a surface of the first metal base material and placing the second metal base material on the applied solder, and heating the first and second metal base materials to a temperature of 90° C. or lower in a specified atmosphere or in a liquid to generate CuGaor (Cu, Ni)Gabetween the first and second metal base materials, thereby joining the first and second metal material.

Solder joint part and method for manufacturing the same

A solder alloy may include a Sn&#x2014;Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, AlO, or a combination thereof.

Solder alloy

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Brisbane, Australia

Stuart David McDonald