Industrial Technology Research Institute

Other

Story Huang

Chun-Hsien Liu

Jia-Bin Hsu

Chia-Hung Hung

Hung-I Lin

Chalson Jan

Szu-Hui Lee

Yvonne Chang

Shin-Hsiung Lee

The invention provides a separation method for object and glue membrane, and it is characterized: an external force such as tearing apart is pre-applied for appropriately separating the glue membrane and the object, such that the binding ability between the object and the glue membrane is reduced, and a taking-and-placing head then sucks up the object; to achieve said objective, it can arrange a vacuum sucking-up seat that is moveable and has vacuum adsorption hole under the glue membrane, and the sucking force of the vacuum sucking-up seat may generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; it is also possible to arrange a connection rod to lower down and lift up the taking-and-placing head simultaneously and, before the taking-and-placing head is lowered down to contact the object, it may bring along the connection rod to press down the glue membrane and generate an external force such as tearing apart to the glue membrane, and the object is then sucked up by the taking-and-placing head; since the external force is not applied upon the object, so it may control the deforming rate of the objet to a minimum degree, such that the object may be avoided from being broken and be not caused to move, and it may also peel apart multiple chips, such that the production speed is increased and the taking-up time is shortened.

Separation method for object and glue membrane

A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.

Position-, speed- and force-controllable chip accessing apparatus

A semiconductor composition material conveyer module, which includes at least one horizontal conveyer unit and at least one vertical conveyer unit arranged with the at least one horizontal conveyer unit to form an automatic production line for conveying semiconductor composition material for processing. A displacement sensor is triggered when semiconductor composition material is delivered from the horizontal conveyer unit at one production line to the matched vertical conveyer unit, thereby causing the matched vertical conveyer unit to carry semiconductor composition material to a horizontal conveyer unit at a second production line for further processing.

Semiconductor composition material conveyer module

Growing community of inventors

Hsinchu, Taiwan

Story Huang