Henkel Ag & Company, Kgaa

E2ip Technologies Inc.

Ablestik (shanghai) Ltd.

Stijn Gillissen

Gunther Dreezen

Rudolf Oldenzijl

Jing Zhou

Shengqian Kong

Anja Henckens

Ralf Dunekake

Thomas Plantenberg

Inge Van Der Meulen

Leticia Borque

Karen Leyssens

Inge Vander Meulen

Grete Van Wuytswinkel

Anja Schneider

Carla Negele

Frank Goethel

Alissa Besler

Tobias Roschek

The present invention relates to a positive temperature coefficient composition comprising a semi-crystalline material, at least one binder, from 0.5 to 9.5% by weight of an electronically conductive material and a solvent. Furthermore, the present invention relates to use of a positive temperature coefficient composition according to the present invention in heating elements and sensors. A positive temperature coefficient composition according to the present invention provides low and stable resistance till self-regulating temperature, which allows fast heating of the heating element. Furthermore, the positive temperature coefficient composition according to the present invention has high PTC ration and therefore, has higher safety and more power can be applied to the heating element.

Positive temperature coefficient composition

The present invention relates to a heating element, which is integrated into the construction material. Integration of the heating element according to the present invention into the construction material limits space needed for the heating system. In addition, the used heating element provides reduced power consumption compared to conventional technologies. A construction element according to the present invention comprises a construction material, a heating element comprising a foil comprising a PTC composition layer or a PTC composition layer, at least one adhesive layer, a substrate and a connector, wherein said heating element is embedded between said construction material and said substrate, and wherein said PTC layer comprises a semi-crystalline material, at least one binder and an electronically conductive material.

Printed heater elements integrated in construction materials

The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Processing of polymer based inks and pastes

A silicon-based curable composition providing improved transparency, mechanical strength and resistance against heat and photo-degradation comprises at least one organopolysiloxane represented by the composition formula (1):(RSiO)(RSiO)(RRSiO)(RSiO)(RSiO)(RRSiO)&#x2003;&#x2003;(1),wherein each Rindependently represents a methacryloxyalkyl group having 5 to 20 carbon atoms and a&#x2267;0, b&#x2267;0, c&#x2267;0, d&#x2267;0, e&#x2267;0, f&#x2267;0, c+e&#x3e;0, and a+b+c+d+e+f=1; and at least one curing catalyst. The product is ideal for encapsulation of LED (light emitting device) elements.

Hybrid silicone composition for light emitting device

This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

Barrier sealant of phenylene oxetane and cationic initiator

The present invention discloses encapsulant materials for use in glob top and/or dam and fill applications comprising base oligomer/monomers preferably having an acrylated/methacrylated or vinylene-containing oligomer/polymer, one or more multifunctional acrylate monomers, one or more thixotropic agents and, optionally, fillers, additives, photoinitiators and/or pigments. The encapsulant has low levels of water absorption and shrinkage.

UV curable protective encapsulant

Growing community of inventors

Hasselt, Belgium

Stijn Gillissen