Irvine Sensors Corporation

Stewart A Clark

John C Carson

A thermal imaging system is disclosed in which infrared radiation from the viewed scene is transmitted to a two-dimensional detector array carried on the focal plane of an optical/electronics module which has embedded in it amplifying, filtering and multiplexing circuitry utilizing MOSFET transistors. The module is located inside the cooling device. Cooling requirements depend on the alternatives (a) of using detectors responsive to wavelengths in the 3.0 to 5.0 micron range, which require less cooling, or (b) of using detectors responsive to wavelengths in the 8.0 to 12.0 micron range, which require liquid nitrogen cooling. The two-dimensional detector array may be combined with a limited scanning, called 'nutation', which causes each detector to view a plurality of pixels in the incoming infrared radiation.

Thermal imager incorporating electronics module having focal plane

A photo-detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconductor material, then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

Detector array module fabrication process

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

High-density electronic processing package--structure and fabrication

A photo detector array module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of photo-detectors on the focal plane end, and of thin film circuitry on the back plane end, each plane is etched to cut back the semiconductor material, then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.

Detector array module-structure and fabrication

High-density electronic processing package-structure and fabrication

A focal plane photo-detector mosaic array is disclosed in which thin stacked substrate layers extending in planes perpendicular to the focal plane provide closely spaced electrical contact points at the focal plane, and photo-detectors on the focal plane which individually communicate with those contact points are arranged in rows extending diagonally with respect to the planes in which the stacked substrate layers extend.

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Irvine, CA, United States of America

Stewart A Clark