Greatbatch Ltd.

Viant As&o Holdings, LLC

Electrochem Solutions Inc.

Steven W Winn

Christine A Frysz

Robert A Stevenson

Dominick J Frustaci

Keith W Seitz

Thomas Marzano

Jason Woods

William C Thiebolt

Xiaohong Tang

Richard L Brendel

Barry C Muffoletto

Thomas A Skwara

Donald H Hickel, Jr

Robert W Siegler

Buehl E Truex

Brian Robert Peterson

Gary C Victor

Michael F Scalise

Matthew L Mroczkowski

Lasantha Viyannalage

Bruehl E Truex

Kenneth E Burnap

Ricahrd L Brendel

Dominck J Frustaci

Sean P Curry

Donald Hickel

Barry Muffaletto

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400&#xb0; C. to about 700&#xb0; C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400&#xb0; C. to about 1,900&#xb0; C. for up to 6 hours; and a cool down portion at a rate of up to 5&#xb0;/minute from a maximum sintering temperature down to about 1,000&#xb0; C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

An orthopedic reamer cutting tool is disclosed that incorporates a second material such as graphene having an increased coefficient of thermal conductivity to remove heat generated at the tissue cutting surface during use. The reamer is constructed having a hemispherical cutting shell that extends from an equatorial base to an apex at a distal end. A plurality of cutting teeth, each having a tissue cutting surface, extend from the exterior of the cutting shell. A reamer driver interface may be positioned spanning the diameter of the reamer base. The second material, having increased thermal conductivity, may be applied to the interior and/or exterior shell surfaces. In addition, the second material may be incorporated within the shell or the driver interface.

Graphene-enhanced orthopedic cutting instruments

An orthopedic bone cutter for cutting bone and tissue is described. The cutting device comprises a support frame having a plurality of radially extending struts to which a cutting shell is removably connected thereto. The frame serves as a universal support structure that provides added mechanical support and stability to which various embodiments of cutting shells may be connected thereto. The bone cutter of the present invention is designed such that the cutting shell may comprise a variety of embodiments that enable the removal of bone and tissue. Embodiments of the cutting shell may comprise at least a partially hemispherical shape in which a plurality of cutting surfaces may extend. In addition, the cutting shell may comprise a plurality of removal cutting blade inserts that are received within slots that extend through the shell thickness.

Disposable cutter acetabular reamer

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device

Various embodiments of modular battery authentication circuits are described. The various modular battery authentication circuits are intended to be utilized with electrically powered devices that do not comprise existing battery authentication capabilities. In one embodiment, a modular battery authentication adapter is described. The adapter comprises a housing in which a modular battery authentication circuit resides. One end of the adapter is positioned within a power input port of a device and a modular battery is positioned within the opposing end of the adapter. The authentication circuit within the adapter communicates with the modular battery to determine its authenticity before allowing the battery to power the device. A modular battery comprising an internal authentication circuit is also described. The modular battery is designed to interact with firmware stored within the device to determine whether the modular battery meets certain operational criteria.

Battery authentication circuit

Deep brain electrodes are remotely sensed and activated by means of a remote active implantable medical device (AIMD). In a preferred form, a pulse generator is implanted in the pectoral region and includes a hermetic seal through which protrudes a conductive leadwire which provides an external antenna for transmission and reception of radio frequency (RF) pulses. One or more deep brain electrode modules are constructed and placed which can transmit and receive RF energy from the pulse generator. An RF telemetry link is established between the implanted pulse generator and the deep brain electrode assemblies. The satellite modules are configured for generating pacing pulses for a variety of disease conditions, including epileptic seizures, Turrets Syndrome, Parkinson's Tremor, and a variety of other neurological or brain disorders.

Satellite therapy delivery system for brain neuromodulation

Growing community of inventors

Lancaster, NY, United States of America

Steven W Winn