H.b. Fuller Licensing & Financing Inc.

Other

The Dow Chemical Company

H.b. Fuller Company

H.n. Fuller Company

Steven W Albrecht

Thomas H Quinn

Thomas F Kauffman

Cynthia L Rickey

David B Malcolm

Robert A Dubois

Michelle C Kueppers

Maynard Lawrence

Beth M Eichler

Steven R Vaughan

Timothy W Roska

Beth M Eichler-Johnson

Lisa L Ryan

Kathryn A Coleman

Vitaly Rogachevsky

Kevin P Burge

Kazuya Suzuki

Mark S Kroll

The present invention includes compositions relating to a hot melt adhesive that includes a copolymer of butene-1, a wax, and a tackifying resin. The present invention further relates to adhesives initially exhibiting adhesion properties and subsequently non-adhesion qualities. Methods of using these adhesives are also part of the claimed invention.

Composition and method relating to a hot melt adhesive

The invention includes a hot melt adhesive composition that includes at least one of an isotactic copolymer of butene-1 and a metallocene catalyzed propylene homopolymer, a tackifying resin, and, optionally, a wax. The adhesive composition initially exhibits adhesion quality and subsequently non-adhesion quality. The invention also includes methods of using the adhesive composition for temporarily bonding substrates.

The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin.

This invention relates to an improved hot melt adhesive comprising a tackifying resin wherein the resin is substantially aliphatic and has a glass transition temperature of greater than 65&deg; C. and a thermoplastic polymer.

Hot melts utilizing a high glass transition temperature substantially aliphatic tackifying resin

Package comprising low application temperature hot melt adhesive comprising ethylene &agr;-olefin

Low application temperature hot melt adhesive comprising ethylene

A hot melt useful for packaging, comprising from about 10% to about 30% by weight of at least one copolymer of ethylene and methyl acrylate (both acrylates and methacrylates); from about 10% to about 20% by weight of at least one copolymer of ethylene and n-butyl acrylate (both acrylates and methacrylates), wherein the total polymer content does not exceed 40% by weight, and the total ethylene n-butyl acrylate copolymer content does not exceed the total ethylene methyl acrylate copolymer content by percent weight in the adhesive; from about 20% to about 60% by weight of at least one tackifying resin selected from the group consisting of rosins and modified rosins and hydrogenated derivatives; aliphatic, cycloaliphatic and aromatic hydrocarbon resins and modified hydrocarbon resins and hydrogenated derivatives; terpenes and modified terpenes and hydrogenated derivatives; and mixtures thereof; from about 5% to about 30% by weight of at least one wax; and up to about 2% by weight of an antioxidant; wherein the resultant adhesive has peel values greater than about 150.degree. F. (about 65.degree. C.).

Hot melt adhesives with excellent heat resistance

Growing community of inventors

Forest Lake, MN, United States of America

Steven W Albrecht