Texas Instruments Corporation

Steven T Jenkins

Nital S Patel

Gregory A Miller

Stephanie Leanne Hilbun

Clifton E Brooks

A method for extracting blanket (qual) polish rates from interferometry signals off patterned (product) wafer polish during non-enpointed CMP. The method includes estimating polish rates using polish data near the end of the polish period. Non-linear regression and iterative optimization is presented to extract relevant information. The processing includes least square processing step ( ), determining the search fit ( ) and determining if this is the best fit ( ).

Method of estimation of wafer polish rates

A tuned run-to-run controlled system is disclosed that provides tuned run-to-run control of a system. The system includes a controlled system coupled to a tuned run-to-run controller, which contains a feedback controller coupled to a tuner. Tuned run-to-run controller determines a feedback command based on a nominal gain, a maximum gain, a process error, and a tuning gain.

System and method for self-tuning feedback control of a system

A method for extracting wafer-to-wafer thickness variation from interferometry signals off patterned (product) wafer polish during non-endpointed CMP. The method includes sensing sample signals representing polishing trace from product wafers near the end of polishing period from at least two product wafers ( ); estimating the value of the phase of the first and second wafers using polish data near the end of the polish period using nonlinear regression algorithm processing ( ) and the GOF test ( ); and calculating the difference in final thickness using the phase ( ).

Method of estimation of wafer-to-wafer thickness

A method for dispatching available lots to unallocated machines is provided that includes receiving metrics data ( ) providing performance measurements for a plurality of machines ( ). The method next provides for determining a state for each of the machines ( ) based on the metrics data ( ). The method next provides for receiving one or more lots ( ) to be dispatched where each lot ( ) has a lot type and each lot type is associated with one of a plurality of models. The method next provides for selecting a preferred lot type ( ) for each of the plurality of models associated with each of the machines ( ) based on the state of the machine. The method next provides for selecting a preferred model ( ) based on a time since a last run of the model, a cost of switching to a new model and lot type, and the state of the machine ( ). The method next provides for resolving conflicts between selected preferred lot type/preferred model combinations when insufficient lots ( ) are available to fill the selections. The method next provides for assigning each lot ( ) to one of the machines ( ) according to the preferred model ( ) and preferred lot type ( ) selections.

Growing community of inventors

Plano, TX, United States of America

Steven T Jenkins