Motorola Corporation

Cts Corporation

Steven Scott Kear

Michael A Newell

Carl Jojola

Terence Patrick Miller

A piezoelectric assembly includes a piezoelectric substrate that has a top surface, a bottom surface, and at least one side surface. A top electrode is defined on the top surface and a first aperture is defined in the top electrode. A bottom electrode is disposed on the bottom surface. The electrodes are formed from a thin film metal. A first thick film bond pad is disposed in the first aperture and is in contact with the piezoelectric substrate. The first thick film bond pad is in electrical contact with the top electrode. In further embodiments, a second thick film bond pad is disposed on either the top surface or in a second aperture defined in the bottom electrode.

Bond pad for use with piezoelectric ceramic substrates

A ceramic block filter (100), having a substantially rectangular block of ceramic material having a top (102), bottom (104), and four side surfaces (106, 108, 110 and 112), and having through-holes (114) running from the top (102) to the bottom surfaces (104); a metallization layer coating on substantially an entire exterior portion of the block and the through-holes (114), with the exception of a part of the top surface (102) of the block being unmetallized; the top surface (102) being beveled at an acute angle with respect to one of the side surfaces of the ceramic block; and coupling input-outputs for providing an input and output for filtering signals.

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Albuquerque, NM, United States of America

Steven Scott Kear