Hyundai Electronics America, Inc.

At&t Global Information Solutions Company

Ncr Corporation

Symbios Logic Inc.

Hynix Semiconductor Inc.

Hyundai Electronics Industries Co. Ltd.

Hyundai Electronics

America & Symbios Logic Inc.

Steven S Lee

Gayle W Miller

Kenneth P Fuchs

Derryl D Allman

Dim-Lee Kwong

The invention concerns a BI-CMOS process, in which Field-Effect Transistors (FETs) and Bipolar Junction Transistors (BJTs) are manufactured on a common substrate. In several processing steps, FET structures are formed simultaneously with BJT structures. For example, in one step, polysilicon gate electrodes for the FETs and polysilicon emitters for the BJTs are formed simultaneously. In another aspect of the invention, a polysilicon layer is used to reduce channeling which would otherwise occur during an implant step.

BI-CMOS integrated circuit

A process for fabricating a bipolar transistor on a silicon-on-insulator substrate which includes etching a bipolar transistor area into the substrate, wherein the bipolar transistor area has substantially vertical sidewalls and a bottom, and forming a buried collector in bottom of the bipolar transistor area. Polysilicon sidewalls are formed adjacent to the vertical sidewalls in the bipolar transistor area, wherein the polysilicon sidewalls are connected to the buried collector. The polysilicon sidewalls are oxidized to form a layer of oxidized polysilicon. Oxide sidewalls are formed on the oxidized polysilicon sidewalls, and epitaxial silicon is formed to fill the bipolar transistor area. A base and an emitter are formed for the bipolar transistor, within the epitaxial barrier.

Bipolar silicon-on-insulator structure and process

A monolithic semiconductor device includes a field effect transistor and a bipolar junction transistor with a pillar emitter structure. The pillar structure raises the BJT emitter above the surface of a trenched base. Ions implanted into the base trench diffuses into an extrinsic base contact region. The pillar elevation structure increases travel distance between the trench and the emitter and protects against encroachment without increasing the total emitter area allocated to the BJT device. A spacer oxide adjacent to the pillar separates the pillar from the trench-region implanted with ions.

Pillar emitter for BiCMOS devices

A fusible link and method for its fabrication. A polysilicon pad is formed on top of an insulating layer and covered with a second insulating layer. A trench is selectively etched into the second insulating layer exposing the top of the polysilicon pad. An fusible aluminum link is then formed over the second insulating layer and trench and conformal therewith. When a programming current is driven through the link, the aluminum melts and is absorbed by the polysilicon pad, thereby preventing the link's growback.

Method of fabrication of semiconductor fuse with polysilicon plate

Method of fabricating a bipolar integrated structure

A method of planarizing a non-planar substrate, such as filling vias and contact holes, spreads a suspension of a conducting material suspended in a liquid on a substrate. The suspension includes an organometallic material, preferably with particles of a polymerized tin or indium alkoxide. The material is spread by spinning the substrate after applying the suspension. The carrier liquid and organic groups are removed by baking and curing at elevated temperatures, thereby depositing the conductive material on the substrate in a layer which is more planar than the substrate and which has regions of greater and lesser thickness. A relatively brief etch step removes conductive material from regions of lesser thickness, leaving material filling vias or contact holes.

Spin-on conductor process for integrated circuits

A semiconductor fuse and method for fabricating the same An insulating layer is provided and a trench formed therein. A fusible link is then formed across the insulating layer and trench and conformal therewith. The link has a break region of minimum thickness and width at an intersection of a sidewall and bottom surface of the trench.

Semiconductor fuse and method

An ink-jet print head comprises an ink drive unit formed on a first substrate and an ink reservoir unit formed on a second substrate. The ink drive unit includes a thin film piezoelectric transducer formed on one side of the substrate. The reservoir unit includes an etched cavity in the substrate for forming an ink reservoir, the cavity having an aperture in the base extending through the substrate to form an ink nozzle. The ink drive and ink reservoir units are bonded together with the piezoelectric transducer within the ink reservoir. Activating the transducer expels ink from the reservoir via the ink nozzle.

Method for making a solid-state ink jet print head

A monolithic semiconductor device includes a field effect transistor and a bipolar junction transistor with an elevated emitter structure. An elevation structure raises the BJT emitter above the plane of the base. The elevation structure increases travel distance between a heavily doped base contact region and the emitter and protects against encroachment without increasing the total surface area allocated to the BJT device. A spacer oxide separates the polysilicon base contact and the elevation structure.

Elevated emitter for double poly BICMOS devices

A process for forming a titanium silicide local interconnect between electrodes separated by a dielectric insulator on an integrated circuit. A first layer of titanium is formed on the insulator, and a layer of silicon is formed on the titanium. The silicon layer is masked and etched to form a silicon strip connecting the electrodes, and an overlying second layer of titanium is formed over the silicon strip. The titanium and silicon are heated to form nonsilicidized titanium over a strip of titanium silicide, and the nonsilicidized titanium is removed.

Process for forming titanium silicide local interconnect

Method of making BI-CMOS integrated circuit having a polysilicon emitter

Solid-state ink-jet print head

A method for forming an amorphous silicon programable element which requires less than about one square micron of area. The method includes the steps of forming a bottom conductor, depositing an interlayer dielectric above the bottom conductor, forming a via in the interlayer dielectric, depositing an anti-fuse layer above the bottom conductor within the via, and chemical vapor depositing a conductive plug above the anti-fuse layer and within the via. The method may additionally include the step of chemical vapor depositing a top conductor above the conductive plug.

Growing community of inventors

Colorado Springs, CO, United States of America

Steven S Lee