Harris Corporation

Steven Robert Snyder

James Joseph Rawnick

Stephen B Brown

Charles Michael Newton

Michael Ray Lange

Paul Bryant Koeneman

Carol Ann Gamlen

Louis Joseph Rendek, Jr

Gregory M Jandzio

Walter M Whybrew

Raymond Charles Rumpf

Casey Philip Rodriguez

Michael D Pleskach

Edward G Palmer

Brett A Pigon

Jay D Warshowsky

Steven C Smith

Mihael Pleskach

An electronic device includes a substrate with a circuit layer thereon that has a solder pad. There is a liquid crystal polymer (LCP) solder mask on the substrate that has an aperture aligned with the solder pad. There is a fused seam between the substrate and the LCP solder mask. Solder is in the aperture, and a circuit component is electrically coupled to the solder pad via the solder. A first dielectric layer stack having a first plurality of dielectric layers is on the LCP solder mask and has an aperture aligned with the solder pad. There is a first LCP outer sealing layer on the first dielectric layer stack, and a second dielectric layer stack having a second plurality of dielectric layers on the substrate on a side thereof opposite the LCP solder mask. Further, there is a second LCP outer sealing layer on the second dielectric layer stack.

Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods

A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Ball grid array (BGA) connection system and related method and ball socket

An electro-fluidic interconnection. The interconnection includes a body () formed of a ceramic material. The body () is provided with an aperture () having a profile suitable for receiving an interconnecting conduit (). The interconnecting conduit () can be formed of the same type of ceramic material as the body (). The conduit () is defined by an outer shell () with a hollow bore () for transporting a fluid. A mating portion () of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion () of the conduit () can be compression fitted within the aperture (). Conductive traces () on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

Electro-fluidic interconnect attachment

A transformer and method of making includes first half primary and secondary windings as metallic circuits that are etched on a metallic cladding of a first liquid crystal polymer (LCP) sheet. Secondary windings are positioned in spaced relation to the primary windings. A second LCP sheet is applied over the first LCP sheet. Second half primary and secondary windings are etched as metallic circuits on a metallic cladding of a second LCP sheet. Respective first and second half primary windings are interconnected to each other and the first and second half secondary windings are connected to each other by conductive vias.

Method of making a transformer

A transformer and method of making same is disclosed. A substantially planar configured, first half primary winding and first half secondary winding are formed over a substantially planar base. The first half primary and secondary windings are overlaid with a ferrite layer. A substantially planar configured, second half primary winding and second half secondary winding are formed over the ferrite layer in stacked relation to the respective first half primary winding and secondary windings. The respective first and second half primary windings and respective first and second half secondary windings are interconnected together.

Transformer and associated method of making

Transformer and associated method of making using liquid crystal polymer (LCP) material

A variable true time delay line () includes an RF transmission line () and at least one fluidic delay unit (). The fluidic delay unit includes a fluidic dielectric contained in a cavity () and coupled to the RF transmission line () along at least a portion of a length thereof. At least one pump is provided for adding and removing the fluid dielectric to the cavity () in response to a time delay control signal. A propagation delay of the RF transmission line is selectively varied by adding and removing the fluid dielectric from the cavity.

Controlling a time delay line by adding and removing a fluidic dielectric

A continuously variable true time delay line () and method for producing a time delay. The true delay line () includes an RF transmission line () and at least a first fluidic dielectric () contained in a cavity () coupled to the RF transmission line along at least a first length thereof. One or more variable displacement fluid processors () are provided for changing a distribution of the fluid dielectric () in the cavity () in response to a time delay control signal (). The propagation delay of the line is selectively varied by changing the distribution of the fluid dielectric in the cavity.

RF delay lines with variable displacement fluidic dielectric

Method and apparatus for producing a variable delay for an RF signal. The method can include the step of propagating the RF signal along an RF transmission line, coupling a fluidic dielectric to the RF transmission line, and dynamically changing a composition of the fluidic dielectric to selectively vary its permittivity in response to a time delay control signal. The method can also include the step of dynamically changing a composition of the fluidic dielectric to vary its permeability. The permittivity and the permeability can be varied concurrently in response to the time delay control signal. In a preferred embodiment the method can include selectively varying the permeability concurrently with the permittivity to maintain a characteristic impedance of the transmission line approximately constant.

RF delay lines with variable composition fluidic dielectric

An electronic module includes a cooling substrate, an electronic device mounted thereon, and a heat sink adjacent the cooling substrate. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber. Furthermore, an evaporator thermal transfer body may be connected in thermal communication between the evaporator chamber and the electronic device. Additionally, at least one condenser thermal transfer body may be connected in thermal communication between the at least one condenser chamber and the heat sink. The evaporator thermal transfer body and the at least one condenser thermal transfer body preferably each have a higher thermal conductivity than adjacent cooling substrate portions.

Electronic module including a cooling substrate and related methods

An electronic module includes a cooling substrate, an electronic device mounted thereon, and a plurality of cooling fluid dissociation electrodes carried by the cooling substrate for dissociating cooling fluid to control a pressure thereof. More particularly, the cooling substrate may have an evaporator chamber adjacent the electronic device, at least one condenser chamber adjacent the heat sink, and at least one cooling fluid passageway connecting the evaporator chamber in fluid communication with the at least one condenser chamber.

Electronic module including a cooling substrate with fluid dissociation electrodes and related methods

A phased array antenna includes an antenna housing including a subarray assembly and a plurality of beam forming network modules positioned on the subarea assembly. An antenna support and interconnect member are mounted on the antenna housing and include a carrier member having a front antenna mounting surface substantially orthogonal to the module support for supporting at least one antenna element. A rear surface has a receiving slot. At least one conductive via is associated with the receiving slot and positioned to extend through the carrier member to a circuit element, such as an antenna element, supported by the mounting surface. A launcher member is fitted into the receiving slot and has a module connecting end that extends rearward to a beam forming network. The launcher member includes conductive signal traces that extend along the launcher member from the conductive via to the module connecting end.

Growing community of inventors

Palm Bay, FL, United States of America

Steven Robert Snyder