Freescale Semiconductor,inc.

Symbol Technologies, LLC

Motorola Corporation

Steven R Young

Robert W Baird

Yi Wei

William J Dauksher

Young Sir Chung

Hao Li

David P Mancini

Donald F Weston

Gary Carl Johnson

Michael J Anderson

David Patrick Stumbo

Raymond Decker

Stephen Lebeau

A touch-screen display apparatus, the apparatus may include first and second sheets having opposed major surfaces and a size and shape defined by a periphery. The periphery may be defined by opposed ends and opposed edges. The first and second sheets may each have a conductive pattern including a pair of opposed busbars and a plurality of traces electrically coupled to, and extending between, corresponding pairs of opposed busbars. The transparent force sensing (TFS) sheet may have opposed major surfaces and a variable resistance which is related to a force exerted upon one or more of its major surfaces. The TFS sheet may be situated between the first and second sheets. The apparatus may also include one or more separation portions situated between the TFS sheet and the first or second sheet to bias the TFS sheet apart from the first or second sheet.

Touch screen rendering system and method of operation thereof

In accordance with a specific embodiment, a method of processing a semiconductor substrate is disclosed whereby the substrate is thinned, and the dice formed on the substrate are singulated by a common process. Trench regions are formed on a backside of the substrate. An isotropic etch of the backside results in a thinning of the substrate while maintaining the depth of the trenches, thereby facilitating singulation of the die.

Ultra-thin die and method of fabricating same

A method for packaging an acoustic wave filter (102). The method includes a step of providing a first wafer (100). The first wafer (100) supports acoustic wave transduction and propagation. The method also includes steps of processing the wafer (100) to provide transducer patterns (18, 18') thereon and disposing a seal ring (25) on the wafer (100). The seal ring (25) completely encloses active areas allowing portions of each bond pad to extend outside of the seal ring. The method further includes steps of disposing a second wafer (40) atop the seal ring (25) and the first wafer (100), sealing the second wafer (40) to the first wafer (100), dicing the second wafer (40) with a saw that provides a first kerf width, whereby portions of the second wafer (40) overlying bonding pads (20) of the transducer patterns (18, 18') are removed and dicing the first wafer (100) with a saw that provides a second kerf width narrower than the first kerf width to provide a packaged SAW die.

Acoustic wave filter package lid attachment apparatus and method

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Gilbert, AZ, United States of America

Steven R Young