Hughes Aircraft Company

Hughes Missile Systems Company

Steven R Goss

Owen H Taggart

Eric M Frey

Apparatus for housing circuit cards that comprises a cylindrical housing having an internal wall having a single diameter. First and second cylindrical heat sinks are provided that each comprise a sloped outer surface. The heat sinks are disposed such that the sloped outer surfaces face each other. First and second circuit cards are secured to distal edges of respective heat sinks, or pairs of circuit cards are secured to both edges of respective heat sinks. Each circuit card comprises at least one internal interface connector that is designed to mate with an internal interface connector of an adjacent circuit card. A cylindrical card lock is provided that has an outer surface that is designed to contact the internal wall of the housing and an inner surface that has a V-shaped cross section having oppositely sloped surfaces. The respective sloped surfaces of the card lock are designed to mate with the sloped outer surfaces of the respective heat sinks. Apparatus is provided for drawing the heat sinks together to cause the sloped surfaces thereof to press against the respective mating sloped surfaces of the card lock and expand the card lock and secure the card lock, heat sinks, and circuit cards in the housing. First and second sealing plates are optionally provided that seal opposite ends of the housing and provide a hermetic enclosure. External interface connectors are provided on the sealing plates to interface to external electronics and couple signals and power to and from the circuit cards.

Circuit card mounting system having a cylindrical housing and circular

A high-density electronics package (10) that houses a plurality of circuit cards (21,22,25,26), heat sinks (23,27) and circuit interconnections (33) in a single housing (12). The electronics package (10) uses conical shaped interfaces for locating and locking components, which greatly enhances the serviceability, thermal management and strength of the electronics package (10). Assembly is accomplished by using a selected conical angle on a first heat sink (23) that mates with a matching conical surface (13) on the housing (12). A second heat sink (27) has a conical angle (located in the opposite direction of the conical angle of the first heat sink) that mates with an identical angle on an expandable wedge ring (31) used for positioning purposes. This mounting feature provides automatic heat sink to heat sink axial alignment regardless of tolerances, therefore simplifying assembly and providing intimate contact between the heat sinks (23,27) and the housing (12), and thus creating a thermal path from the circuit cards (21,22,25,26) to the housing (12). A model of the electronics package (10) has been designed, built and tested, and provides a lightweight, thermally conductive, and structurally sound electronics package (10). The present package concept also provides for greater serviceability, easier fabrication, faster assembly, lower cost and increased design latitude. The electronics package (10) is easily fabricated and requires no special tooling. Assembly of components into the housing (12) is accomplished within minutes and disassembly is equally fast and easy.

High density electronics package having stacked circuit boards

A multiple die is used to trim a plurality of electrical component leads, all at the same time, by using a die and a hydraulic press to develop a shearing action. Male and female die members each define a pattern of holes arrayed to mate with the configuration of leads extending from an electronic package. Near the upper face of the female die member, a plurality of tiny O-rings are mounted, one for each lead, encircling the paths for the leads as the package is positioned atop the die. The transverse relative motion between the male and female members of the die shears the leads while the O-rings serve to isolate and limit the amount of shock and vibration that can be transmitted along the leads.

Growing community of inventors

Tucson, AZ, United States of America

Steven R Goss