Emc Corporation

Emc IP Holding Company LLC

Steven R Cieluch

John Kevin Bowman

W Brian Cunningham

C Ilhan Gundogan

Gerald J Cote

David Boudreau

Joseph P King

Dale T Morgan

Daniel A Field

Albert F Beinor, Jr

Michael Robillard

Lawrence J Feroli

James W Espy

Joseph P DeYesso

Robert M Beauchamp

Robert P Wierzbicki

Ralph C Frangioso, Jr

Keith Clifford Johnson

John Victor Burroughs

Thomas J Connor

Gordon A Frye

Michael L Schillinger

Bassem Bishay

Samuel Zeman

A method and computer program product for determining an internal temperature of a computing device, a power consumption factor for the computing device, and an airflow factor for the computing device. An approximated ambient air temperature is generated based upon the internal temperature, power consumption factor, and the airflow factor. A workload factor is determined for the computing device and a fan speed for the computing device is controlled based at least in part upon the approximated ambient air temperature and the workload factor.

System and method for controlling fan speed

A power measurement transducer includes a first surface configured to thermally couple the power measurement transducer to a device under test. A second surface is essentially parallel to and spaced apart from the first surface. Two or more temperature measurement elements are positioned between the first and second surfaces. The power measurement transducer is configured to allow at least a portion of the power generated within the device under test to enter the power measurement transducer through the first surface and exit the power measurement transducer through the second surface.

Power measurement transducer

A method of determining thermal output of a device under test includes attaching a power measurement transducer to a device under test, wherein the power measurement transducer includes two or more temperature measurement elements. A test sequence is applied to the device under test. One or more signals produced by the power measurement transducer are monitored to determine a quantity of power produced by the device under test during the test sequence.

A power measurement transducer includes a thermally conductive heat spreading device having a first surface configured to thermally couple the power measurement transducer to a device under test. Two or more temperature measurement elements are positioned within the thermally conductive heat spreading device.

A method and computer program product for determining an internal temperature of a computing device, a power consumption factor for the computing device, and an airflow factor for the computing device. An approximated ambient air temperature is generated based upon the internal temperature, power consumption factor, and the airflow factor.

System and method for approximating ambient temperature

A cabinet having a pair of vertically stacked chassis separated by a central, vertically extending region. A pair of laterally spaced, vertically extending panels is disposed in the central region, the panels forming: a pair of outer compartments for receiving air exiting a corresponding one of the pair of laterally spaced vertically stacked chassis; and an inner compartment for receiving air exiting the pair of vertically stacked chassis. The panels have therein an array of openings in a lower portion thereof for passing portions of air in the outer compartments into the inner compartment. An upper portion of the panels inhibits portions of air in the outer compartments from passing into the inner compartment. The openings extend in rows horizontally across the panel. The number of opening in lower ones of the rows is greater than the number of opening in upper ones of the rows.

Electrical cabinet having multi-channel exhaust with bleeding vents to alleviate back-pressure

An improved redundant computing apparatus has a chassis assembly configured to (i) mount to a standard electronic equipment rack and (ii) consume substantially 1U of space in a particular direction within the standard electronic equipment rack. The chassis assembly includes a housing and a midplane disposed within the housing. The apparatus further includes a set of power supply/blower assemblies configured to electrically connect to and electrically disconnect from the midplane of the chassis assembly in a hot swappable manner, and a set of computing devices configured to electrically connect to and electrically disconnect from the midplane of the chassis assembly in a hot swappable manner. By way of example, the set of computing devices is adapted to move data into and out of a set of disk drives on behalf of a set of external host computers.

Techniques for redundant computing from within a 1U form factor with improved serviceability and high availability characteristics

Front panel for an electronic cabinet

Described is a bezel for an electronics enclosure. The bezel frame includes a frame, first and second plunger mechanisms, a shuttle, and a locking mechanism. The locking mechanism has a cam disposed in a path of lateral movement of the first plunger mechanism. The cam is located between that plunger mechanism and a tab of the shuttle. The orientation of the cam determines the extent of lateral movement of the plunger mechanisms. In one orientation, the cam restricts the lateral movement of the first plunger mechanism and urges the shuttle into a position that restricts the lateral movement of the second plunger mechanism. Consequently, neither plunger mechanism is able to move far enough laterally to disengage from a mounting structure.

Locking mechanism for securing the bezel of an electronics enclosure to a rack structure

Front panel for electronic cabinet

Growing community of inventors

Allston, MA, United States of America

Steven R Cieluch