Nexperia B.v.

Steven Peake

Phil Rutter

The present disclosure relates to a trench metal-oxide-semiconductor field-effect transistor, trench MOSFET, and to a method for manufacturing such transistors. In particular, the present disclosure relates to trench MOSFETs having deep trenches adjacent to the more shallow gate defining trench for obtaining a RESURF effect. According to the present disclosure, an ion implantation region of a charge type similar to that of the drift region is formed in the drift region. The ion implantation region extends below the deep trenches of the trench MOSFET and is vertically aligned with a base of the deep trenches.

Trench MOSFET

This disclosure relates to a combined MOS controlled diode (MCD) and MOS transistor semiconductor device and associated method of manufacture. The semiconductor device includes an epitaxial semiconductor layer arranged on a semiconductor substrate and a matrix of trenches formed in the epitaxial layer, with the matrix of trenches including a first plurality of spaced apart parallel trenches and a second plurality of spaced apart parallel trenches. Each of the first plurality of parallel trenches is orthogonal to each of the second plurality of parallel trenches and gate electrodes are arranged in each of the first plurality of spaced apart parallel trenches. Source electrodes are arranged in each of the second plurality of spaced apart parallel trenches.

Combined MCD and MOS transistor semiconductor device

This disclosure relates to a power semiconductor device and a method of manufacturing the same, including: a semiconductor layer defining a first major surface and a drift region and a trench extending from the first major surface into the semiconductor layer. The trench includes a gate electrode surrounded by a gate dielectric configured and arranged to electrically isolate the gate electrode from the semiconductor layer; and a source region extending from the first major surface and abutting a top side-wall portion of the trench, and the source region extends to a depth corresponding to a top surface of the gate electrode.

Growing community of inventors

Nijmegen, Netherlands

Steven Peake