International Business Machines Corporation

Steven P Young

John Ulrich Knickerbocker

Charles Hampton Perry

Lester W Herron

Robert W Nufer

Gaetano Paolo Messina

Philip L Flaitz

John Acocella

Joseph M Harvilchuck

Srinivasa N Reddy

Seaho Song

Albert J Fahey

Arlyne M Flanagan

An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.

Apparatus for indirect impingement cooling of integrated circuit chips

A method for co-sintering ceramic/metal multi-layered ceramic substrates wherein X-Y shrinkage is controlled and X-Y distortion and Z-direction chamber are substantially eliminated. Binder-burnoff is substantially not aggravated during this process as well. The process is accomplished by applying selective forces to the surfaces of the ceramic substrates to control lateral movement while allowing Z direction shrinkage movement. Frictional force means, pneumatic forced means and weights are among the means used to supply forces. Cerium oxide is used in certain embodiments to enhance binder-burnoff.

Method and means for co-sintering ceramic/metal MLC substrates

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Lagrangeville, NY, United States of America

Steven P Young