Gsi Group Corporation

General Scanning, Inc.

Eastman-kodak Company

Gsi Lumonics Corporation

Steven P Cahill

Bradley L Hunter

Jonathan S Ehrmann

Michael Plotkin

Donald J Svetkoff

Roger G Covington

Bo Gu

Kurt A Pelsue

You Chia Li

Rainer Schramm

Kevin E Sullivan

A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.

Laser-based method and system for processing targeted surface material and article produced thereby

A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.

Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site

A method of calibrating a laser marking system includes calibrating a laser marking system in three dimensions. The step of calibrating includes storing data corresponding to a plurality of heights. A position measurement of a workpiece is obtained to be marked. Stored calibration data is associated with the position measurement. A method and system for calibrating a laser processing or marking system is provided. The method includes: calibrating a laser marker over a marking field; obtaining a position measurement of a workpiece to be marked; associating stored calibration data with the position measurement; relatively positioning a marking beam and the workpiece based on at least the associated calibration data; and calibrating a laser marking system in at least three degrees of freedom. The step of calibrating includes storing data corresponding to a plurality of positions and controllably and relatively positioning a marking beam based on the stored data corresponding to the plurality of positions.

Method and system for calibrating a laser processing system and laser marking system utilizing same

A high-speed precision positioning apparatus has a stage supported by a platen. The stage is driven by a plurality of drive motors that are co-planar with the stage and arranged symmetrically around the stage. The drive motors apply drive forces directly to the stage without any mechanical contact to the stage. The drive forces impart planar motion to the stage in at least three degrees of freedom of motion. In the remaining three degrees of freedom the motion is constrained by a plurality of fluid bearings that operate between the stage and the platen. The drive motors are configured as magnets, attached to the stage, moving in a gap formed in-between top and bottom stationary coils. Integral force cancellation is implemented by a force cancellation system that applies cancellation forces to the stage. The cancellation forces, which are co-planar with a center of gravity of the stage and any components that move with the stage, cancel forces generated by planar motion of the stage. Interferometric encoders are used as position detectors.

High-speed precision positioning apparatus

A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis. The reference data is generated by the system which includes a modulator for reducing power of the material-processing laser beam to obtain a probe laser beam to measure height of the semiconductor wafer at a plurality of locations about the site to obtain reference height data. A computer computes a reference surface based on the reference height data. A trajectory planner generates trajectories for the wafer and the waist of the laser beam based on the reference surface.

Structure is provided for separately sealing an optical disk cartridge and cooperating apparatus closed when the cartridge and apparatus are not operatively engaged for intended use, and for opening the cartridge and apparatus to each other while jointly closing them from the environment when they are so engaged. The optical disk includes a magnetically attractable hub bearing a compliant annular seal. The disk-containing cartridge is permanently closed except for a central drive-access opening in one wall thereof that is bounded by a circular rim concentrically aligned with the hub seal. Magnetic means on that wall atrract the hub and thereby draw its seal into firm contact with the rim, to seal the opening closed whenever the cartridge is not in use. The cooperating apparatus includes a drive spindle that is bounded by a circular flange also concentrically aligned with the hub seal. Associated mechanism engages the spindle axially with the hub so as to move the flange into contact with the hub seal while moving the seal out of contact with the rim. Encircling the spindle is a resiliently flexible housing member bearing a compliant annular seal concentrically aligned with both the flange and the rim. The housing member is biased toward the flange and rim so as to urge its seal into contact with either the flange, to seal the housing closed whenever the spindle is not engaged with the hub, or the rim, to seal the housing to the cartridge when the spindle is so engaged.

Growing community of inventors

Newton, MA, United States of America

Steven P Cahill